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Large-Periphery ALGaN/GaN High Electron Mobility Transistors for High-Power Operation

机译:适用于大功率工作的大尺寸ALGaN / GaN高电子迁移率晶体管

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We report on AlGaN/GaN high electron mobility transistors (HEMTs) for high-power operation achieved by selective-area growth (SAG) technique based on plasma-assisted molecular beam epitaxy (PAMBE). Significant improvements in current density and on-state resistance were observed when SAG was employed. Maximum current of 1.75A and on-state resistance of 4.76mΩ cm2 were demonstrated for a large-periphery HEMT with total gate width of 5.2mm. Low Schottky gate leakage current was also realized by the suppression effect of SAG and the use of Si3N4/SiO2 gate insulators, leading to a high gate breakdown voltage of over 200V at a short gate-to- drain distance of 6µm.
机译:我们报告了通过基于等离子体辅助分子束外延(PAMBE)的选择性区域生长(SAG)技术实现的用于高功率操作的AlGaN / GaN高电子迁移率晶体管(HEMT)。使用SAG时,观察到电流密度和导通电阻的显着改善。对于总栅极宽度为5.2mm的大外围HEMT,已证明最大电流为1.75A,导通电阻为4.76mΩcm2。通过SAG的抑制作用和Si3N4 / SiO2栅极绝缘体的使用,还实现了低肖特基栅极漏电流,从而在6μm的短栅-漏距离下导致了超过200V的高栅极击穿电压。

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