首页> 外文会议>Proceedings of 2010 International Symposium on VLSI Technology, System and Application >Hole band anisotropy effect on ON-state performance of biaxial compressive strained SiGe-based short channel QW pMOSFETs: Experimental observations
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Hole band anisotropy effect on ON-state performance of biaxial compressive strained SiGe-based short channel QW pMOSFETs: Experimental observations

机译:孔带各向异性对双轴压缩应变基于SiGe的短沟道QW pMOSFET导通状态性能的影响

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Quantum well (QW) FETs with compressively-strained SiGe channel are promising candidates for pMOSFET for future logic technology with scaled operating voltage [1–3]. High hole mobility observed in strained SiGe channel layer, as compared to Si, is expected to result in enhanced performance of these devices for deep submicron channel lengths. However, most of experimental results in literature so far, focusing on [011] channel direction on relaxed (100) Si bulk substrate have shown mobility degradation (hence drive current degradation) or marginal drive current enhancement at short channel regime in pseudomorphic SiGe based channels over Si control [4–7]. This has been attributed to effects of additional Coulomb scattering (from Nit and halo) and from neutral defects [4], as shown in Fig. 1. While these are indeed additional source of defects over Si counterpart inhibiting performance enhancement, highly anisotropic hole band structure with biaxial compressive strained SiGe channel could also play an important role on the ON-state performance degradation especially in deep submicron regime. In this paper we investigate the channel orientation dependence on the performance in an optimized Si0.5Ge0.5 QW channel. Strong drive current (mobility) enhancement is observed in [010] versus [011]. This directional dependence is further amplified at shorter channel lengths and lower temperature, and is explained on the basis of anisotropy in band structure.
机译:具有压缩应变SiGe沟道的量子阱(QW)FET是pMOSFET的有前途的候选者,可用于未来的逻辑技术,具有按比例缩放的工作电压[1-3]。与硅相比,在应变的SiGe沟道层中观察到的高空穴迁移率有望提高这些器件在深亚微米沟道长度方面的性能。然而,迄今为止,文献中的大部分实验结果都集中在松弛(100)硅块状衬底上的[011]沟道方向上,显示在基于伪晶硅锗的沟道中,短沟道状态下迁移率降低(因此驱动电流降低)或边际驱动电流提高通过硅控制[4-7]。如图1所示,这归因于额外的库仑散射(来自N it 和晕圈)和中性缺陷的影响[4],而这些确实是硅对应物的额外缺陷源。为了抑制性能的提高,具有双轴压缩应变SiGe沟道的高各向异性孔带结构也可能在导通状态性能下降中发挥重要作用,尤其是在深亚微米条件下。在本文中,我们研究了优化的Si 0.5 Ge 0.5 QW通道中通道取向对性能的依赖性。在[010]与[011]中观察到强大的驱动电流(迁移率)增强。在更短的沟道长度和更低的温度下,这种方向依赖性被进一步放大,并基于能带结构的各向异性进行了解释。

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