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Analysis of film thickness for magnetron sputtering system with more than one workbench

机译:具有多个工作台的磁控溅射系统的膜厚分析

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In this article, the thickness uniformity of thin films deposited by magnetron sputtering system involved in both planetary circumrotate model and traditional model by rectangle target were investigated respectively. It was shown that the thickness uniformity of films by magnetron sputtering system with rotation and revolution at the optimum ratio value of Wz/Wg 0.5 is superiority to traditional system which with 0.3 of thickness relative deviation at coordinative condition. Moreover, the relative deviation was dropped as the addition of distance from substrate to target. The results were in accord with that obtained experimentally.
机译:本文研究了磁控溅射系统沉积的薄膜厚度均匀性问题,该方法涉及矩形靶材的行星旋转模型和传统模型。结果表明,在Wz / Wg的最佳比值为0.5的情况下,具有旋转和公转的磁控溅射系统的薄膜厚度均匀性优于传统系统,其在配合条件下的厚度相对偏差为0.3。而且,随着从基板到靶材的距离的增加,相对偏差减小。结果与实验结果相符。

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