首页> 外文会议>Quality of Electronic Design (ISQED), 2009 10th International Symposium on >A unified FinFET reliability model including high K gate stack dynamic threshold voltage, hot carrier injection, and negative bias temperature instability
【24h】

A unified FinFET reliability model including high K gate stack dynamic threshold voltage, hot carrier injection, and negative bias temperature instability

机译:统一的FinFET可靠性模型,包括高K栅叠层动态阈值电压,热载流子注入和负偏置温度不稳定性

获取原文

摘要

A unified FinFET reliability model including high K stack dynamic threshold (HKSDT), hot carrier injection (HCI), and negative bias temperature instability (NBTI) has been developed and verified by experimental data. The FinFET-based circuit performances are simulated and compared under these reliability issues by HSPICE simulator after the inclusion of the presented model.
机译:已经开发出并通过实验数据开发和验证包括高k堆叠动态阈值(HKSDT),热载体喷射(HCI),热载体喷射(HCI)和负偏置温度不稳定(NBTI)的统一FinFET可靠性模型。在包含所呈现的模型之后,通过HPHICE模拟器模拟基于FinFET的电路性能。

著录项

相似文献

  • 外文文献
  • 中文文献
  • 专利
获取原文

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号