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Post-silicon programmed body-biasing platform suppressing device variability in 45 nm CMOS technology

机译:硅后编程的身体偏置平台可抑制45 nm CMOS技术中的器件差异

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The Post-Silicon Programmed Body-Biasing Platform is proposed to suppress device variability in the 45-nm CMOS technology era. The proposed platform measures device speed during post-fabrication testing. Then the fast die is marked so that the body-bias circuit turns on and reduces leakage current of the die that is selected and marked in a user application. Because the slow die around the speed specifications of a product is not body-biased, the product runs as fast as a normal non-body-biasing product. Although the leakage power of a fast die is reduced, the speed specification does not change. The proposed platform improves the worst corner specification comprising the two worst cases of speed and leakage power. The test chip, fabricated using 45-nm technology, improves the worst corner of stand-by leakage power vs. speed by 70%.
机译:提出了硅后编程的身体偏置平台,以抑制45纳米CMOS技术时代的器件可变性。拟议的平台可在制造后测试期间测量设备速度。然后,对快速裸片进行标记,以使体偏置电路导通并减少在用户应用中选择和标记的裸片的泄漏电流。由于围绕产品速度规格的慢冲模没有偏心,因此该产品的运行速度与普通的无偏心产品一样快。尽管降低了快速模具的泄漏功率,但速度规格不变。所提出的平台改进了最坏的转弯规格,包括速度和泄漏功率这两种最坏的情况。该测试芯片采用45纳米技术制造,可将待机泄漏功率相对于速度的最坏情况提高70%。

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