Insights into correlation between board-level drop reliability and package-level ball impact test

摘要

The ball impact test is developed as a package-level measure for the board-level drop reliability of solder joints in the sense that it leads to fracturing of solder joints around the intermetallics, similar to that from a board-level drop test. In this paper, both board-level drop test and package-level ball impact test are examined numerically for solder joints of different Sn-Ag-Cu compositions. Correlations between the drop reliability and characteristics of the impact force profile are sought