Empirical correlation between package-level ball impact test and board-level drop reliability

摘要

Package-level ball impact test and board-level drop test are performed and correlated using a specific chip-scale package with solder joints of different Sn-Ag-Cu solder compositions. A positive correlation is found between characteristics of the impact force profile and reliability from the drop test, which provides a supporting basis for the package-level ball impact test to serve as a substitute of the timely and costly board-level drop test.