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Corrosion of Sn-Ag-Cu Lead-free Solders and the Corresponding Effects on Board Level Solder Joint Reliability

机译：Sn-Ag-Cu无铅焊料的腐蚀及其对板级焊料接头可靠性的影响

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《Electronic Components and Technology Conference, 2006. Proceedings. 56th》|2006年|P.891-898|共8页
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Fubin Song; Lee S.W.R.;
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1. Board-level drop reliability and fracture behavior of low-temperature soldering Sn-Ag-Cu/Sn-Bi-X hybrid BGA solder joints for consumer electronics [J] . J. Ren, M. L Huang Journal of materials science . 2021,第11期

机译：低温焊接SN-AG-CU / SN-Bi-X混合BGA焊点用于消费电子产品的板级降低性和断裂行为
2. Assessment of board level solder joint reliability for PBGA assemblies with lead-free solders [J] . Shi-Wei Ricky Lee, Ben Hoi Wai Lui, Y. H. Kong, Soldering & Surface Mount Technology . 2002,第3期

机译：评估使用无铅焊料的PBGA组件的板级焊点可靠性
3. Effect of Soldering Temperature on the Reliability of Sn-Ag-Cu Lead-Free Solder Joints [J] . Xinmeng Zhai, Yuefeng Li, Jun Zou, Journal of Electronic Materials . 2021,第3期

机译：焊接温度对Sn-Ag-Cu无铅焊点可靠性的影响
4. Corrosion of Sn-Ag-Cu Lead-free Solders and the Corresponding Effects on Board Level Solder Joint Reliability [C] . Song F., Lee S.W.R. Electronic Components and Technology Conference . 2006

机译：Sn-Ag-Cu无铅焊料的腐蚀和对底板焊接接头可靠性的相应影响
5. Microstructural changes under isothermal aging and their influence on thermal fatigue reliability for tin-lead and lead-free solder joints, including microstructural changes under isothermal aging in mixed solder joints [D] . Choubey, Anupam 2007

机译：锡铅和无铅焊点在等温老化下的微观结构变化及其对热疲劳可靠性的影响，包括混合焊点在等温老化下的微观结构变化
6. Reliability issues of lead-free solder joints in electronic devices [O] . Nan Jiang, Liang Zhang, Zhi-Quan Liu, 2019

机译：电子设备中无铅焊点的可靠性问题
7. Preparation of Lead-free Composite Powder Solder Paste and Study on Reliability of Lead-free Solder Joint [O] . 王建 2012

机译：无铅复合粉末焊锡膏的制备及无铅焊点可靠性研究

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