首页> 外文会议>Electron Devices Meeting, 2005. IEDM Technical Digest. IEEE International >BE-SONOS: A bandgap engineered SONOS with excellent performance and reliability
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BE-SONOS: A bandgap engineered SONOS with excellent performance and reliability

机译:BE-SONOS:带隙设计的SONOS,具有出色的性能和可靠性

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A bandgap engineered SONOS with greatly improved reliability properties is proposed. This concept is demonstrated by a multilayer structure of O1/N1/O2/N2/O3, where the ultra-thin "O1/N1/O2" serves as a non-trapping tunneling dielectric, N2 the high-trapping-rate charge storage layer, and O3 the blocking oxide. The ultra-thin "O1/N1/O2" provides a "modulated tunneling barrier" - it suppresses direct tunneling at low electric field during retention, while it allows efficient hole tunneling erase at high electric field due to the band offset. Therefore, this BE-SONOS offers fast hole tunneling erase, while it is immune to the retention problem of the conventional SONOS. With a N+-poly gate, we achieve self-convergent erased Vt ~3 V, suitable for NOR flash application. On the other hand, by using a P+-poly gate, a depletion mode device (Vt < 0) is obtained, and a very large memory window (> 6 V) is achieved, ideal for MLC-NAND application. Excellent performance and reliability for both applications are demonstrated. Furthermore, with this simple structure and no new materials BE-SONOS is readily manufacturable
机译:提出了一种带隙设计的SONOS,其可靠性性能得到了极大的改善。 O1 / N1 / O2 / N2 / O3的多层结构证明了这一概念,其中超薄的“ O1 / N1 / O2”用作非俘获隧穿电介质,N2是高俘获率电荷存储层和O3的阻隔氧化物。超薄的“ O1 / N1 / O2”提供了“调制隧穿势垒”-抑制了保留期间低电场下的直接隧穿,同时由于带偏移而允许在高电场下有效的空穴隧穿擦除。因此,此BE-SONOS提供了快速的空穴隧穿擦除,而不受传统SONOS的保留问题的影响。利用N + -多晶硅门,我们实现了自收敛的擦除Vt〜3 V,适用于NOR闪存应用。另一方面,通过使用P + -多晶硅门,可以获得耗尽型器件(Vt <0),并且获得了非常大的存储窗口(> 6 V),非常适合MLC -NAND应用程序。展示了这两种应用的出色性能和可靠性。此外,凭借这种简单的结构,无需任何新材料即可轻松制造BE-SONOS

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