首页> 外文会议>Reliability Physics Symposium Proceedings, 2004. 42nd Annual >Gate oxide multiple soft breakdown (Multi-SBD) impact on CMOS inverter
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Gate oxide multiple soft breakdown (Multi-SBD) impact on CMOS inverter

机译:栅氧化物多次软击穿(Multi-SBD)对CMOS反相器的影响

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The impact of gate oxide multiple soft breakdown (Multi-SBD) on the performance of CMOS inverter has been demonstrated. The results indicate that the CMOS inverter is still functioning when Multi-SBD event occurs, but noise margin degraded rapidly after extending a period of time. Moreover, off-state leakage current increasing and gate induced drain leakage (GIDL) phenomenon are other concerns. Multi-SBD may be acceptable in reliability viewpoint and the results also imply that we can relax the failure criteria of gate oxide reliability to allow a higher operation voltage, but it must depend on circuit design and application rather for all cases.
机译:已经证明了栅极氧化物多次软击穿(Multi-SBD)对CMOS反相器性能的影响。结果表明,发生Multi-SBD事件时CMOS反相器仍在工作,但噪声裕度在延长一段时间后迅速降低。此外,关态漏电流的增加和栅极感应漏极漏(GIDL)现象是其他需要关注的问题。从可靠性的角度来看,Multi-SBD可能是可以接受的,其结果还暗示我们可以放宽栅极氧化物可靠性的失效标准,以允许更高的工作电压,但它必须取决于电路设计和应用,而不是在所有情况下都如此。

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