首页> 外文会议>Indium Phosphide and Related Materials, 2003. International Conference on >Theoretical and experimental investigation of temperature-dependent avalanche multiplication in InP-based heterojunction bipolar transistors with InGaAs/InP composite collector
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Theoretical and experimental investigation of temperature-dependent avalanche multiplication in InP-based heterojunction bipolar transistors with InGaAs/InP composite collector

机译:InGaAs / InP复合集电极的基于InP的异质结双极晶体管中与温度有关的雪崩倍增的理论和实验研究

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The temperature-dependent collector breakdown behavior in InP HBTs with InGaAs/InP composite collector has been investigated. A detailed modeling of the temperature-dependent breakdown behavior in InP/InGaAs composite collector to quantitatively verify the experimental data was carried out. It has been found that, although the variation of impact ionization coefficient due to the change of temperature may affect the device breakdown, the temperature-dependent breakdown behavior observed in InGaAs/InP composite collector could be mainly due to the carrier transport in the InGaAs region. As temperature is increased, the increase in the contribution of InGaAs layer to the junction breakdown due to the reduction of electron velocity v/sub e/(T) and relaxation time /spl tau//sub e/(T) could be the root cause of the reduction of junction breakdown voltage.
机译:研究了具有InGaAs / InP复合集电极的InP HBT中与温度有关的集电极击穿行为。对InP / InGaAs复合收集器中温度相关击穿行为进行了详细建模,以定量验证实验数据。已经发现,尽管由于温度变化引起的碰撞电离系数的变化可能会影响器件的击穿,但是在InGaAs / InP复合集电极中观察到的与温度相关的击穿行为可能主要是由于载流子在InGaAs区域中的传输所致。 。随着温度升高,由于电子速度v / sub e /(T)和弛豫时间/ spl tau // sub e /(T)降低而导致的InGaAs层对结击穿的贡献增加可能是根本原因。结击穿电压降低的原因。

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