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Practical phase control technique for alternating phase shift mask fabrication

机译:用于交替相移掩模制造的实用相控技术

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Techniques of fabricating altPSMs of single trenc structure by quartz etching have been developed. A two-step etching process was adopted to make the side-etchign structure. Shifter areas were etched by dry-method in first step and by wet-method in second step. In the experiments, by a RIE type dry-etching machine, a hydrofluoric (HF) acid etching system, a phase measurement system (MPM-248) and 6025-mask plate were used. We optimized dry-etching parameter, such as pressure, RF power and composition of gas mixture ratio. The smallest phase difference between the deviuce-pattern and the monitor-pattern was obtained in low pressure with inactive gas. The dry etching uniformity was improved and range value was reduced from 2.7 degrees to 1.1 degrees by using type B of the plate holder. In wet etching process, two modes of movement and two concentration of buffered HF acid were compared from the viewpoint of etching uniformity. The technique described in this study can be aplied to 150 nm node altPSMs fabrication and shows an extensibility to 130 nm node.
机译:已经开发了通过石英刻蚀制造单晶结构的altPSM的技术。采用两步刻蚀工艺来制作侧面刻蚀结构。移位区在第一步通过干法刻蚀,而在第二步通过湿法刻蚀。在实验中,通过RIE型干蚀刻机,使用了氢氟酸(HF)酸蚀刻系统,相测量系统(MPM-248)和6025掩模板。我们优化了干法刻蚀参数,例如压力,射频功率和气体混合比组成。在低压下用惰性气体获得偏差模式和监测器模式之间的最小相位差。通过使用板保持器的B型,改善了干法蚀刻的均匀性并且将范围值从2.7度减小到1.1度。在湿法蚀刻工艺中,从蚀刻均匀性的角度比较了两种运动模式和两种浓度的缓冲HF酸。本研究中描述的技术可以应用于150 nm节点altPSMs的制造,并显示出可扩展至130 nm节点的能力。

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