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Fe doping and preparation of semi insulating InP by wafer annealing under Fe phosphide vapor pressure

机译:铁的掺杂和磷化铁蒸气压下晶片退火制备半绝缘InP

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摘要

Semi-insulating (SI) InP has been industrially produced by doping Fe atoms as deep acceptors. Fe concentrations in InP are, however, largely varied from top to tail along the crystal growth axis because of impurity segregation. In the present work, we have examined the possibility of vapor phase doping for producing 50 mm diameter SI InP wafers with constant Fe concentrations by using a wafer annealing procedure. Small amount of Fe was charged with red phosphorus in ampoules in which InP wafers were annealed. It was found that the vapor phase doping is effective for Fe doping in InP. The present technology can be applied for the production of low Fe doped SI InP wafers with the same Fe concentration for all wafers from one InP ingot.
机译:半绝缘(Si)InP已经通过掺杂Fe原子作为深层受体而成。然而,InP中的Fe浓度在很大程度上因杂质隔离而从顶部到晶体生长轴的尾部变化。在本作工作中,我们研究了通过使用晶片退火程序生产具有恒定Fe浓度的50mm直径的Si InP晶片的气相掺杂的可能性。在安瓿中加入少量Fe,其中Inp晶片退火。发现气相掺杂对于INP中的Fe掺杂是有效的。本技术可用于生产低Fe掺杂的Si InP晶片,其具有来自一个InP锭的所有晶片的Fe浓度。

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