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Controlled formation of high Schottky barriers on InP and related materials

机译:在InP和相关材料上受控形成高肖特基势垒

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摘要

The present status of the various ingenious approaches made until now to increase Schottky barrier heights (SBHs) on InP and related materials are reviewed from the viewpoints of the mechanism of SBH increase, the SBH values achieved, the controllability and reproducibility of the process, and the barrier reliability. The approaches discussed include: (1) formation of insulator interlayers, (2) formation of semiconductor interlayers, (3) sulphur and selenium surface treatments, (4) low temperature metal deposition, (5) plasma surface treatments, and (6) electrochemical deposition. Particular emphasis is placed on the in-situ electrochemical process by the author's group where Fermi level pinning seems to be removed.
机译:从SBH升高的机理,达到的SBH值,工艺的可控性和可重复性的观点出发,回顾了迄今为止在InP和相关材料上增加肖特基势垒高度(SBH)的各种巧妙方法的现状。屏障的可靠性。讨论的方法包括:(1)形成绝缘体中间层;(2)形成半导体中间层;(3)硫和硒表面处理;(4)低温金属沉积;(5)等离子体表面处理;以及(6)电化学方法)沉积。作者小组特别强调了费米能级钉扎似乎已被消除的原位电化学过程。

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