首页> 外文会议>Indium Phosphide and Related Materials, 1995. Conference Proceedings., Seventh International Conference on >Growth condition dependence of n-type carriers at the interface between InP substrates and epitaxial layers grown by MOCVD
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Growth condition dependence of n-type carriers at the interface between InP substrates and epitaxial layers grown by MOCVD

机译:InP衬底与通过MOCVD生长的外延层之间的界面处n型载流子的生长条件依赖性

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We investigated the dependence of n-type carriers at the interface between InP substrates and epitaxial layers grown by MOCVD on the phosphine (PH/sub 3/) partial pressure and the growth temperature sequence. The carrier concentration decreases with increasing PH/sub 3/ partial pressure. The carrier concentration also reduces when the temperature during thermal etching is high, and the temperature during the initial growth stage is low. Silicon and oxygen were detected as impurities at the interface by secondary ion mass spectrometry (SIMS) measurement. The silicon concentration is no less than 1/spl times/10/sup 17/ cm/sup -3/ under all growth conditions. The oxygen concentration varied from 1/spl times/10/sup 17/ cm/sup -3/ to 8/spl times/10/sup 17/ cm/sup -3/ and had no relationship with the carrier concentration.
机译:我们调查了InP衬底和通过MOCVD生长的外延层之间的界面上的n型载流子对磷化氢(PH / sub 3 /)分压和生长温度序列的依赖性。载流子浓度随PH / sub 3 /分压的增加而降低。当热蚀刻期间的温度高而初始生长阶段的温度低时,载流子浓度也降低。通过二次离子质谱(SIMS)测量,在界面处将硅和氧检测为杂质。在所有生长条件下,硅浓度均不小于1 / spl倍/ 10sup 17 / cm / sup -3 /。氧浓度在1 / spl×10 / sup 17 / cm / sup -3 /〜8 / spl×10 / sup 17 / cm / sup -3 /之间变化,与载流子浓度无关。

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