Hygrothermal reliability evaluation of plastic IC packages withcomputer-aided engineering tools

机译：塑料IC封装的湿热可靠性评价。计算机辅助工程工具

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This paper presents the development and application of acomputer-aided engineering tool, EPACK(TM), for hygro-thermal-mechanicalperformance and reliability evaluation of plastic IC packages. With thisuser-friendly and fully automated tool, a packaging engineer can performreliability evaluation of a plastic IC package in minutes

机译：本文介绍了机器人的开发与应用。用于湿热机械的计算机辅助工程工具EPACK（TM）塑料IC封装的性能和可靠性评估。有了这个用户友好且完全自动化的工具，包装工程师可以执行几分钟即可完成塑料IC封装的可靠性评估

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《Proceedings of the 1994 IEEE International Symposium on Intelligent Control, 1994, 1994》|1994年|p.158-168|共11页
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Kuo A.-Y.; Nguyen L.T.;
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中图分类自动化技术、计算机技术;
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Hygrothermal reliability evaluation of plastic IC packages withcomputer-aided engineering tools

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