Effects of underfill encapsulant on the mechanical and electricalperformance of a functional flip chip device

摘要

The curing conditions and material properties such as thecoefficient of thermal expansion, glass transition temperature, Young'smodulus, and moisture content of four different underfill encapsulantswith different size and content of filler and epoxy are measured. Theeffects of these underfills on the flow rate, mechanical performance,and electrical performance of a solder-bumped functional flip chip on anorganic substrate are studied