Experimental study on the thermo-mechanical effects of underfill and low-CTE substrate in a flip-chip device

摘要

Moire interferometry was used to analyze the thermal deformation of four flip-chip devices mounted on FR-4 substrate and a new multi-layer substrate, with and without underfill. Thermal loading was applied by cooling the devices from 100℃ to room temperature (25℃). The effects of underfill and the low-CTE (coefficient of thermal expansion) substrate on thermal deformation were investigated. The experimental results showed that the underfill curved in a manner similar to the silicon chip. For the flip-chip devices mounted on the multi-layer substrate, the CTE mismatch between the silicon chip and substrate was reduced, and bending deformation decreased. Of the four flip-chip devices studied, the underfilled flip-chip device mounted on the multi-layer substrate had the least deformed solder balls.