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Passivation of InP surfaces

机译:InP表面钝化

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摘要

Results of a study of the suitability of various insulators in combination with various deposition techniques for the passivation of InP surfaces are presented. It is shown that among the techniques investigated, the best results were obtained with the remote plasma-enhanced chemical vapor deposition (PECVD) technique. The benefits of integral photoluminescence measurements for judging the influence of a variety of process steps during InP passivation on the semiconductor surface are discussed.
机译:给出了各种绝缘体与各种沉积技术相结合以钝化InP表面的适用性的研究结果。结果表明,在所研究的技术中,使用远程等离子体增强化学气相沉积(PECVD)技术可获得最佳结果。讨论了积分光致发光测量对判断InP钝化过程中各种工艺步骤对半导体表面的影响的好处。

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