首页> 外文期刊>IEEE Electron Device Letters >Reduction of the surface recombination current in InGaAs/InP pseudo-heterojunction bipolar transistors using a thin InP passivation layer
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Reduction of the surface recombination current in InGaAs/InP pseudo-heterojunction bipolar transistors using a thin InP passivation layer

机译:使用薄InP钝化层减少InGaAs / InP伪异质结双极晶体管中的表面复合电流

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摘要

In an InGaAs/InP pseudo-heterojunction bipolar transistor (PHBT) with InP passivation, regions from the emitter mesa edge to the base contact are protected by a thin InP barrier layer. By using such a passivation, the surface recombination current is effectively suppressed. The DC current gain obtained for such a PHBT is as high as 455, compared to a maximum value of 240 for a normally passivated PHBT. The current gain is also found to be independent of the perimeter-to-area ratio of the emitter mesa as a result of the passivation.
机译:在具有InP钝化的InGaAs / InP伪异质结双极晶体管(PHBT)中,从发射极台面边缘到基极接触的区域受到薄InP势垒层的保护。通过使用这种钝化,有效地抑制了表面复合电流。与普通钝化PHBT的最大值240相比,针对此类PHBT的DC电流增益高达455。由于钝化,还发现电流增益与发射器台面的周长/面积比无关。

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