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Passivation of InP/GaAsSb/InP double heterostructure bipolar transistors with ultra thin base layer by low-temperature deposited SiN_x

机译:通过低温沉积SiN_x钝化具有超薄基极层的InP / GaAsSb / InP双异质结构双极晶体管

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The InP/GaAsSb/InP double heterostructure bipolar transistors with 20-nm-thick base layer are passivated by low-temperature deposited SiN_x. The SiN_x passivation results in an increase of the current gain, seen from common-emitter I- V characteristics. An improvement of the Early voltage is also observed after the passivation. The study of the forward Gummel plots shows that the collector current keeps unchanged, while the base current decreases after SiN passivation. A decrease of the base current ideality factor is found by the SiN passivation. The passivation also results in an improvement of the base-collector junction. In contrast, the leakage current of the base-collector junction increases tow orders after passivation.
机译:具有20 nm厚基极层的InP / GaAsSb / InP双异质结构双极晶体管被低温沉积的SiN_x钝化。从共发射极IV特性来看,SiN_x钝化导致电流增益增加。钝化后还可以观察到早期电压的提高。对正向Gummel曲线的研究表明,SiN钝化后,集电极电流保持不变,而基极电流减小。通过SiN钝化发现基本电流理想因数降低。钝化还导致基极-集电极结的改善。相反,钝化后,基极-集电极结的泄漏电流增加了两个阶数。

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