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Characterization of split gate flash memory endurance degradation mechanism

机译:分裂栅闪存耐久性下降机制的表征

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In this paper, the weak erase failure mechanism of a source side injected split gate flash memory after endurance (ENDU) cycling test has been identified through a 2T cell structure. In general, charge trapping in the inter poly oxide (IPO) after Fowler Nordheim tunneling erase is considered to dominate the weak erase failure. However from this study, it is found that cell current reduction after erase is not due to erase-induced tunneling oxide degradation. On the contrary, program-induced electron trapping in the coupling oxide dominates the cell current reduction after long term endurance cycling stress.
机译:本文通过2T单元结构确定了耐久性(ENDU)循环测试后,源侧注入的分裂栅闪存的弱擦除失败机制。通常,在Fowler Nordheim隧穿擦除之后,电荷被捕集在多晶硅氧化物(IPO)中,这是弱擦除失败的主要原因。然而,从这项研究中发现,擦除后单元电流的减少并不是由于擦除引起的隧穿氧化物降解引起的。相反,在长期耐受循环应力后,程序性电子俘获在耦合氧化物中占主导地位的是电池电流的降低。

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