Face to Face Hybrid Wafer Bonding for Fine Pitch Applications

摘要

This work demonstrates face-to-face hybrid wafer bonding at GLOBALFOUNDRIES, including fine pitch characterization and processing, along with preliminary reliability results. Bonding alignment data analysis is shown, as it is imperative to have high bonding alignment in order to assure full yield of the fine pitch interconnects. As a preliminary proof- of-concept check, simple device test data is shown as a way to electrically analyze the bond quality. Limited thermal stress testing results for reliability (utilizing JEDEC-type standards) are shown as well, proving a robust build quality.