机译:3-D集成中晶圆级细间距Cu / Sn / Cu互连的固态扩散键合
School of Electronic Science and Technology, Dalian University of Technology, Dalian, China;
Institute of Microelectronics, Tsinghua University, Beijing, China;
Institute of Microelectronics, Tsinghua University, Beijing, China;
School of Electronic Science and Technology, Dalian University of Technology, Dalian, China;
Institute of Microelectronics, Tsinghua University, Beijing, China;
Bonding; Annealing; Surface treatment; Surface resistance; Kelvin; Microstructure;
机译:低温Cu-Sn固态扩散键合3D型集成的实验和计算研究
机译:晶圆级Cu / Sn到Cu / Sn SLID键合互连,具有更高的强度
机译:三维集成中细间距互连的低温Cu / In键合特性
机译:细间距Cu / Sn / Cu互连的低温固态扩散键合
机译:液相扩散键合和用于高温无铅电气连接的Cu-Ni / Sn复合焊膏的开发
机译:温度梯度下Cu / Sn / Cu互连中液-固界面处Cu6Sn5金属间化合物的生长动力学
机译:金属合金Cu表面钝化导致用于3D IC和异构整合应用的高质量细间距凸块Cu-Cu键合