A Novel Differential Multi-Bit Carbon Nanotube Through Silicon Vias

摘要

Aiming at the problem of I/O limitation between layers in three-dimensional integrated circuits, a novel type of differential multi-bit carbon nanotube TSV is proposed. The equivalent circuit model of the structure is established in ADS. The simulation results of S parameters in ADS and HFSS can fit well. Compared with the traditional GSSG TSV and two kinds of novel two-bit TSVs (G-SS-G and GS-SG), the proposed differential multi-bit CNT TSV saves chip area, improves the integration density, and has superior anti-interference ability.