机译:三维集成电路碳纳米管基屏蔽通孔通孔电气建模
Hangzhou Dianzi Univ Sch Elect & Informat MOE Engn Res Ctr Smart Microsensors & Microsyst Hangzhou 310018 Peoples R China;
Hangzhou Dianzi Univ Sch Elect & Informat MOE Engn Res Ctr Smart Microsensors & Microsyst Hangzhou 310018 Peoples R China;
Hangzhou Dianzi Univ Sch Elect & Informat MOE Engn Res Ctr Smart Microsensors & Microsyst Hangzhou 310018 Peoples R China;
Hangzhou Dianzi Univ Sch Elect & Informat MOE Engn Res Ctr Smart Microsensors & Microsyst Hangzhou 310018 Peoples R China|Zhejiang Prov Key Lab Adv Microelect Intelligent Hangzhou Peoples R China;
Hangzhou Dianzi Univ Sch Elect & Informat MOE Engn Res Ctr Smart Microsensors & Microsyst Hangzhou 310018 Peoples R China;
high frequency; shielded structure; three#8208; dimensional integrated circuits; through#8208; silicon vias;