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Gate and barrier layer design of E-mode GaN HEMT with p-GaN gate structure

机译:具有p-GaN栅极结构的E型GaN HEMT的栅极和势垒层设计

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Excellent material properties of gallium nitride (GaN) make it have broad application prospects in the fields of medium and low voltage consumer power, new energy vehicles, charging piles. The conventional GaN high electron mobility transistor (GaN HEMT) is in the ON-state at zero gate bias, which is inconsistent with the actual application requirements. So the regulation of the threshold voltage of GaN devices is currently the research hotspot. Among the existing methods, the p-GaN structure is relatively mature and has been applied in practical products, but there are still many problems in related research. This paper mainly studies the influence of some structural parameters of the device on its threshold voltage and saturation current. The structural parameters considered in this paper mainly include the barrier layer Al composition and the length of the p-GaN layer. The breakdown characteristics of the device after optimizing the structural parameters are simulated. The optimized device threshold voltage is 1.4V and the breakdown voltage is 650V.
机译:氮化镓(GaN)的优异材料性能使其在中低压消费电力,新能源汽车,充电桩等领域具有广阔的应用前景。常规的GaN高电子迁移率晶体管(GaN HEMT)在零栅极偏压下处于导通状态,这与实际应用要求不符。因此,GaN器件阈值电压的调节是当前研究的热点。在现有方法中,p-GaN结构相对成熟并且已经在实际产品中应用,但是相关研究仍然存在许多问题。本文主要研究器件的某些结构参数对其阈值电压和饱和电流的影响。本文考虑的结构参数主要包括势垒层Al的组成和p-GaN层的长度。模拟了优化结构参数后器件的击穿特性。优化的器件阈值电压为1.4V,击穿电压为650V。

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