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An aging-aware model for the leakage power of nanoscaled digital integrated circuits in IoT era

机译:物联网时代纳米数字集成电路泄漏功率的老化感知模型

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Complementary metal oxide semiconductor (CMOS) transistors are considered as dominant technology in semiconductor industry. However, downscaling these transistors, despite of many achievements, has resulted in the rise of reliability issues. Environmental parameters namely temperature and power supply as well as circuit parameters such as duty cycle and frequency also time effect can lead to variations in some circuit characteristics. The large dependency of leakage power to the variations of parameters increases the importance of modeling. This paper is intended to introduce a new aging-aware model in order to calculate the leakage power consumption. Firstly, the leakage power as a function of these parameters, making use of the proposed model, is calculated for standard cells. Next, the power consumption of the same standard cells are measured by HSPICE. Next, we apply this model which is additive to calculate the leakage power of ISCAS85 and ISCAS89 benchmark circuits for 32nm and 22nm CMOS technology. Finally, the accuracy of this model is evaluated by comparing the calculated results from the additive model and HSPICE full-chip simulation results. We demonstrate that our simple yet accurate and additive model results in the maximum 4.74% mean percentage error.
机译:互补金属氧化物半导体(CMOS)晶体管被认为是半导体工业中的主导技术。然而,尽管取得了许多成就,但缩小这些晶体管的尺寸却导致了可靠性问题的增加。环境参数(例如温度和电源)以及电路参数(例如占空比和频率)以及时间效应会导致某些电路特性的变化。泄漏功率对参数变化的很大依赖性增加了建模的重要性。本文旨在介绍一种新的老化感知模型,以计算泄漏功耗。首先,利用建议的模型,针对标准电池计算出作为这些参数的函数的泄漏功率。接下来,通过HSPICE测量相同标准单元的功耗。接下来,我们应用此模型,该模型可以累加计算32nm和22nm CMOS技术的ISCAS85和ISCAS89基准电路的泄漏功率。最后,通过将加性模型的计算结果与HSPICE全芯片仿真结果进行比较,来评估该模型的准确性。我们证明了我们简单而准确的累加模型会导致最大4.74%的平均百分比误差。

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