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The enhancement mode AlGaN/GaN high electron mobility transistor based on charge storage

机译:基于电荷存储的增强模式AlGaN / GaN高电子迁移率晶体管

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In this paper, we sums up our resent progress on the enhancement-mode (E-mode) AlGaN/GaN high electron mobility transistors (HEMTs) which are based on charge storage, including the split floating gates (FGs) HEMT and the one with oxide-SiN-oxide (ONO) gate dielectrics stack. For the FGs HEMT, the Vth variation with the polarization charge density, the density of two dimensional electron gas, the tunnel dielectric thickness, the blocking dielectric thickness, the length and isolating spacing of FGs are presented. The reliability of the FGs HEMT are also revealed. For the HEMT with ONO gate dielectrics stack, the E-mode is realized by negative charge storage within the SiN trap layer. The Vth variation with the programming condition and the thickness of the dielectrics are presented. Under proper programming voltage and time, the Vth can be increased to more than 2V. Moreover, it is found that the breakdown voltage of such HEMT can be adjusted by varying the gate dielectric stacks.
机译:在本文中,我们总结了基于电荷存储的增强模式(E模式)AlGaN / GaN高电子迁移率晶体管(HEMT)的最新进展,其中包括分立浮栅(FG)HEMT和具有氧化物-SiN-氧化物(ONO)栅极电介质堆叠。对于FGs HEMT,给出了FGs随极化电荷密度,二维电子气密度,隧道电介质厚度,阻挡电介质厚度,长度和隔离间距的变化。还揭示了FG HEMT的可靠性。对于具有ONO栅极电介质堆栈的HEMT,E模式是通过在SiN陷阱层内存储负电荷实现的。给出了V th 随编程条件和电介质厚度的变化。在适当的编程电压和时间下,第V 可以增加到2V以上。而且,发现可以通过改变栅极电介质叠层来调节这种HEMT的击穿电压。

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