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Formation of Shallow PN Junction by Cluster Boron Implantation and Rapid Annealing Using Infrared Semiconductor Laser

机译:使用红外半导体激光通过簇硼植入和快速退火形成浅PN结的形成

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We report shallow PN junctions and analysis of their electrical characteristics. Infrared semiconductor laser annealing using carbon films as optical absorption layer was adapted to the activation of silicon implanted with boron cluster ions. We carried out implantations of boron clusters at 6 keV with an equivalent boron concentration of 1.0 X 10~(15) cm~(-2). Laser irradiation at 375 kW/cm~(2) was conducted to activate impurities. Secondary ion mass spectroscopy revealed that boron atoms with a concentration of 6.0 X 10~(14) cm~(-2) were incorporated into silicon surface within a 10 nm depth. The free carrier absorption analyses and current-voltage characteristics of the PN junction diode indicated that the boron atoms were effectively activated by laser annealing.
机译:我们报告了浅层的PN结和它们的电气特性分析。使用碳膜作为光学吸收层的红外半导体激光退火适用于植入硼簇离子的硅的活化。我们在6keV下进行硼簇的植入,其等同硼浓度为1.0×10〜(15)cm〜(-2)。进行375kW / cm〜(2)的激光照射以激活杂质。二次离子质谱显示浓度为6.0×10〜(14 )cm〜(-2)的硼原子掺入10nm深度内的硅表面中。 PN结二极管的自由载波吸收分析和电流 - 电压特性表明,通过激光退火有效地激活硼原子。

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