Structual and Thickness Distribution Evaluation of a Multi-Layer Photomask Blank with a X-Ray Reflectivity Method

摘要

The film thickness estimation is one of most important subject for the design up of photomask blank. To decrease the producing cot of silicon semiconductor chips, control photomask specifications and evaluate thickness technologies are the key technology. The grazing-incidence X-ray reflectivity method is very useful in order to measure thickness, density and interface roughness of photomask blank. In this paper, we report the adaptation of the X-ray reflectivity technology to photomask evaluation and prepare a thickness distribution map of mono- and multi-layer photomask blank.