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Structual and Thickness Distribution Evaluation of a Multi-Layer Photomask Blank with a X-Ray Reflectivity Method

机译:用X射线反射率法评估多层光掩模坯的结构和厚度分布

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摘要

The film thickness estimation is one of most important subject for the design up of photomask blank. To decrease the producing cot of silicon semiconductor chips, control photomask specifications and evaluate thickness technologies are the key technology. The grazing-incidence X-ray reflectivity method is very useful in order to measure thickness, density and interface roughness of photomask blank. In this paper, we report the adaptation of the X-ray reflectivity technology to photomask evaluation and prepare a thickness distribution map of mono- and multi-layer photomask blank.
机译:膜厚估计是光掩模坯料设计中最重要的主题之一。为了减少硅半导体芯片的生产量,控制光掩模规格和评估厚度技术是关键技术。掠入射X射线反射率法对于测量光掩模坯料的厚度,密度和界面粗糙度非常有用。在本文中,我们报告了X射线反射率技术对光掩模评估的适应性,并准备了单层和多层光掩模坯料的厚度分布图。

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