adhesives; finite element analysis; integrated circuit interconnections; integrated circuit reliability; solders; vias; wafer level packaging; TMV; bottom package; corner adhesive; corner adhesive material; critical solder ball; diagonal corner solder ball; eWLP PoP package; embedded wafer level package; finite element simulation; overmold thickness reduction; package on package; solder joint reliability; structural parameter effects; temperature -40 degC to 125 degC; thermal cycle loading conditions; thermo-mechanical reliability; through mold via; underfill materials; vertical interconnect; Compounds; Creep; Electronics packaging; Reliability; Soldering; Strain; Thermal loading;
机译:层叠封装嵌入式晶圆级封装的散热能力
机译:使用嵌入式晶圆级封装方法开发级联封装
机译:晶圆级芯片级封装的热机械可靠性的提高
机译:嵌入式晶片级包装(EWLP)包装(POP)封装的热电机可靠性研究
机译:溅射法制备CZTS太阳能电池循环弯曲过程中测量ITO薄膜电阻变化的实验技术使用板级跌落试验研究晶圆级芯片规模封装的可靠性。
机译:扇出晶圆和面板级包装作为异构集成的包装平台
机译:前言:高级包装,材料,加工和可靠性的专题部分:高密度晶片/面板级和薄,灵活,移动套件的尖端解决方案