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机译:晶圆级芯片级封装的热机械可靠性的提高
State Key Laboratory of ASIC and System,School of Microelectronics,Fudan University,Shanghai 200433, China;
State Key Laboratory of ASIC and System,School of Microelectronics,Fudan University,Shanghai 200433, China;
State Key Laboratory of ASIC and System,School of Microelectronics,Fudan University,Shanghai 200433, China;
Tongfu Microelectronics Co., LTD,Nantong 226006, Jiangsu, China;
Tongfu Microelectronics Co., LTD,Nantong 226006, Jiangsu, China,School of Microelectronics,Tianjin University,Tianjin 300072, China;
Mechanical Engineering,Chung Hua University,Hsinchu 30012, Taiwan;
Density; Solders; Reliability; Semiconductor wafers; Stress; Design; Fatigue life; Finite element model; Solder joints; Packaging; Thermomechanics; Fatigue; Epoxy resins; Taguchi methods; Cycles; Polymers; Displacement; Fracture (Materials); Coating processes; Coatings;
机译:微观结构演化对晶圆级芯片尺度包Sn-Ag-Cu焊料互连的长期可靠性的影响
机译:晶圆级芯片级封装中重新分布线的电迁移可靠性研究
机译:等温时效和Sn晶粒取向对晶圆级芯片级封装Sn-Ag-Cu焊料互连的长期可靠性的影响
机译:优化焊料高度和形状,以提高晶片级芯片规模封装的热机械可靠性
机译:芯片封装相互作用(CPI)及其对倒装芯片封装可靠性的影响。
机译:用于无线供电的神经接口系统的薄膜柔性天线和硅CMOS整流器芯片的协同设计方法和晶圆级封装技术
机译:使用晶圆级芯片级封装的用于无线微系统的折叠式芯片尺寸天线