Enhancement of thermal conductivity of die attach adhesives (DAAs) using nanomaterials for high brightness light-emitting diode (HBLED)

摘要

This research investigates novel nanomaterials filled conductive adhesives for application in High Brightness LEDs packaging. Low cost, green, and large scale synthesis as well as functionalization methods were developed to achieve various types of nano-fillers, including silver nanorod, nickel nanochain and nanosized silver particles. These nano-fillers can be used together with the conventional larger silver fillers as “nano-additives”, which can fill the gaps and form thermal and electrical “shortcuts” among the conventional large particles to create a continuous, direct, and multichannel heat dissipation pathway. As a result, the thermal conductivity of the whole DAA system was increased significantly. The morphologies, compositions, and interaction between the nanomaterials and the polymers were carefully studied using a series of techniques including Transmission Electron Microscopy (TEM), Scanning Electron Microscopy (SEM), and X-Ray Diffraction (XRD) etc. The thermal conductivity of the developed DAAs was analyzed by thermal conductivity measurement system.