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High performance die attach adhesives (DAAs) nanomaterials for high brightness LED
High performance die attach adhesives (DAAs) nanomaterials for high brightness LED
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机译:用于高亮度LED的高性能芯片粘接胶(DAA)纳米材料
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摘要
The present invention relates to a composition for a one-part die attach adhesives material useful for packaging semi-conductors including HB-LED. The composition of the present invention includes a thermal and electrical conductive filler, a polymer matrix and a solvent which form a material with high thermal conductivity, low curing temperature and high self-life temperature. The present invention also relates to a method of preparing said composition by mixing a size-selected and surface-modified filler formulation, a polymer matrix and a non-reactive organic solvent together followed by curing the mixture at a low temperature.
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