Integrating solder bumpers for high shock applications

摘要

This paper demonstrates a novel concept for the shock protection of MEMS suspensions: solder is incorporated within the sidewalls of the suspension to produce protective armouring. This provides solder-solder contact at the extremes of the suspension travel, greatly increasing the shock resistance. Model suspension systems were fabricated using deep reactive ion etching (DRIE) and shock tested in a drop-test rig at acceleration levels up to 6000g. The solder armour proved to double the shock resistance of the MEMS suspension.