High-density silicon carrier transmission line design for chip-to-chip interconnects

摘要

Two differential stripline configurations with pitches of 8µm and 22µm are designed for ultra dense interconnect on silicon carrier. The transmission lines are implemented using four wiring levels to support chip-to-chip communication at 11.5Gb/s data rate over 2cm without equalization. Loss characteristics are extracted from test coupons with good model-to-hardware correlation. Impedance and temperature dependent loss performance are analyzed with simulation. Crosstalk performance between two pairs with and without ground shielding, as well as between two twisted pairs, are also evaluated with hardware measurement.