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2011 IEEE 20th Conference on Electrical Performance of Electronic Packaging and Systems

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1.3D via modeling simplification on multilayer mid-planes

机译：通过简化多层中平面的建模进行3D
- 作者：Li Qian;Melde Kathleen L.;Yeh Gong-Jong;Wu Hui;Yang Yaochao
- 会议名称：《2011 IEEE 20th Conference on Electrical Performance of Electronic Packaging and Systems》 | 2011年
- Cascade Method;
- Signal Integrity;
- Simplification;
- Via Modeling;
2.Common-mode noise reduction schemes for differential serpentine delay microstrip line in high-speed digital circuits

机译：高速数字电路中差分蛇形延迟微带线的共模降噪方案
- 作者：Shiue Guang-Hwa;Tsai Yi-Chin;Hsu Che-Ming;Shiu Jia-Hung
- 会议名称：《2011 IEEE 20th Conference on Electrical Performance of Electronic Packaging and Systems》 | 2011年
- common-mode noise;
- differential serpentine delay line;
- differential-to-common mode conversion;
3.Design of a 12Gb/s transceiver for high-density links with discontinuities using modal signaling

机译：使用模态信令设计用于不连续的高密度链路的12Gb / s收发器的设计
- 作者：Milosevic Pavle;Schutt-Aine Jose E.
- 会议名称：《2011 IEEE 20th Conference on Electrical Performance of Electronic Packaging and Systems》 | 2011年
- Crosstalk mitigation;
- high-speed;
- modal decomposition;
- signaling;
4.A de-embedding method for extracting S-parameters of vertical interconnect in advanced packaging

机译：一种在高级封装中提取垂直互连S参数的去嵌入方法
- 作者：Chang Yin-Cheng;Hsu Shawn S. H.;Chang Da-Chiang;Lee Jeng-Hung;Lin Shuw-Guann;Juang Ying-Zong
- 会议名称：《2011 IEEE 20th Conference on Electrical Performance of Electronic Packaging and Systems》 | 2011年
- TSVs;
- bump;
- de-embedding;
- extraction;
- interconnect;
5.High-speed performance of Silicon Bridge die-to-die interconnects

机译：硅桥芯片间互连的高速性能
- 作者：Braunisch Henning;Aleksov Aleksandar;Lotz Stefanie;Swan Johanna
- 会议名称：《2011 IEEE 20th Conference on Electrical Performance of Electronic Packaging and Systems》 | 2011年
- 3D interconnects;
- 3D packages;
- electronic packages;
- high-speed channels;
- multiconductor transmission lines;
- signal integrity;
6.Through-silicon via (TSV) depletion effect

机译：硅通孔（TSV）耗尽效应
- 作者：Cho Jonghyun;Kim Myunghoi;Kim Joohee;Pak Jun So;Kim Joungho;Lee Hyungdong;Lee Junho;Park Kunwoo
- 会议名称：《2011 IEEE 20th Conference on Electrical Performance of Electronic Packaging and Systems》 | 2011年
- TSV coupling;
- depletion;
- distortion;
- large signal;
- measurement;
- nonlinearity;
- through-silicon via (TSV);
7.Impact of Through-Silicon-Via capacitance on high frequency supply noise in 3D-stacks

机译：硅通孔电容对3D堆栈中高频电源噪声的影响
- 作者：Trivedi Amit Ranjan;Yueh Wen;Mukhopadhyay Saibal
- 会议名称：《2011 IEEE 20th Conference on Electrical Performance of Electronic Packaging and Systems》 | 2011年
- 3DIC;
- High frequency noise;
- Power Delivery Network;
- Through-Silicon-Via;
8.Waveform relaxation and overlapping partitioning techniques for tightly coupled interconnects

机译：紧密耦合互连的波形松弛和重叠分割技术
- 作者：Farhan Mina;Nakhla Natalie;Nakhla Michel;Achar Ram;Ruehliy Albert
- 会议名称：《2011 IEEE 20th Conference on Electrical Performance of Electronic Packaging and Systems》 | 2011年
9.Capacitance calculation for a shared-antipad via structure using an integral equation method based on partial capacitance

机译：基于局部电容的积分方程法计算共享防焊盘过孔结构的电容
- 作者：Wang Hanfeng;Ruehli Albert E.;Fan Jun
- 会议名称：《2011 IEEE 20th Conference on Electrical Performance of Electronic Packaging and Systems》 | 2011年
- integral equation method;
- partial capacitance;
- shared-antipad via structure;
- via-plane capacitance;
10.Three finite-element time-domain-based numerical algorithms for high-frequency broadband PCB simulations

机译：三种基于时域的有限元数值算法，用于高频宽带PCB仿真
- 作者：Li Xiaolei;Jin Jian-Ming;Tan Jilin
- 会议名称：《2011 IEEE 20th Conference on Electrical Performance of Electronic Packaging and Systems》 | 2011年
- Integrated circuit;
- domain decomposition;
- finite element method;
- printed circuit board;
- time domain analysis;
11.CAD model reconstruction of solder balls for the computationally efficient electromagnetic field simulation

机译：用于高效计算电磁场仿真的焊球CAD模型重建
- 作者：Hillebrand Jurgen;Kiess Steffen;Wang Yu;Wroblewski Marek;Simon Sven
- 会议名称：《2011 IEEE 20th Conference on Electrical Performance of Electronic Packaging and Systems》 | 2011年
- CAD model;
- Computed tomography;
- electromagnetic field simulation;
- scattering parameters;
12.Optimal decoupling capacitors design for suppressing edge radiation of power/ground planes

机译：最佳去耦电容器设计，可抑制电源/地平面的边缘辐射
- 作者：Li Kuan-Wei;Wu Kai-Bin;Wu Ruey-Beei
- 会议名称：《2011 IEEE 20th Conference on Electrical Performance of Electronic Packaging and Systems》 | 2011年
- EMI;
- decoupling capacitors;
- normal mode;
- radiation;
13.Plane bounce in high-speed single-ended signaling I/O interfaces

机译：高速单端信令I / O接口中的平面反弹
- 作者：Oh Dan
- 会议名称：《2011 IEEE 20th Conference on Electrical Performance of Electronic Packaging and Systems》 | 2011年
- SSN;
- ground bounce;
- mutiple reference planes;
- plane bounce;
- reference voltage;
- simultaneous switching noise;
- supply bounce;
14.Practical aspects of modeling apertures for signal and power integrity co-simulation

机译：为信号和电源完整性进行联合仿真的光圈建模的实践方面
- 作者：Choi Jae Young;Swaminathan Madhavan
- 会议名称：《2011 IEEE 20th Conference on Electrical Performance of Electronic Packaging and Systems》 | 2011年
- microstrip line;
- power distribution network;
- power integrity;
- return path discontinuity;
- signal integrity;
15.Verification of novel technology for power integrity on 16-channel 3Gbps circuit boards

机译：验证16通道3Gbps电路板上电源完整性的新技术
- 作者：Sasaoka Norifumi;Ochi Takafumi;Akiyama Yutaka;Kono Kazuo;Ueda Chihiro;Otsuka Kanji
- 会议名称：《2011 IEEE 20th Conference on Electrical Performance of Electronic Packaging and Systems》 | 2011年
- impedance;
- power integrity;
16.Deriving voltage tolerance specification for processor circuit design

机译：推导处理器电路设计的电压容限规范
- 作者：Zhou Tingdong;Friedrich Joshua D.;Becker Wiren D.
- 会议名称：《2011 IEEE 20th Conference on Electrical Performance of Electronic Packaging and Systems》 | 2011年
- Power integrity;
- voltage tolerance specification;
17.Early stage chip/package/board co-design techniques for system-on-chip

机译：片上系统的早期芯片/封装/电路板协同设计技术
- 作者：Tanaka Mikiko Sode;Toyama Masahiro;Mori Ryo;Nakashima Hidenari;Haida Masahiro;Ooshima Izumi
- 会议名称：《2011 IEEE 20th Conference on Electrical Performance of Electronic Packaging and Systems》 | 2011年
- IR-drop;
- co-design;
- co-simulation;
18.High-density silicon carrier transmission line design for chip-to-chip interconnects

机译：用于芯片到芯片互连的高密度硅载流子传输线设计
- 作者：Gu Xiaoxiong;Turlapati Lavanya;Dang Bing;Tsang Cornelia K.;Andry Paul S.;Dickson Timothy O.;Beakes Michael P.;Knickerbocker John U.;Friedman Daniel J.
- 会议名称：《2011 IEEE 20th Conference on Electrical Performance of Electronic Packaging and Systems》 | 2011年
- electrical interconnect;
- signal integrity;
- silicon carrier;
- transmission line;
19.Wireless RF data communications using 60 GHz antennas in Multi-Core systems

机译：在多核系统中使用60 GHz天线的无线RF数据通信
- 作者：Yeh Ho-Hsin;Hiramatsu Nobuki;Melde Kathleen L.
- 会议名称：《2011 IEEE 20th Conference on Electrical Performance of Electronic Packaging and Systems》 | 2011年
20.Electrical performance of vertical natural capacitor for RF system-on-chip in 32-nm technology

机译：垂直自然电容器的电性能，用于32 nm技术的片上RF系统
- 作者：Liu En-Xiao;Li Er-Ping
- 会议名称：《2011 IEEE 20th Conference on Electrical Performance of Electronic Packaging and Systems》 | 2011年
21.Alternative SPICE implementation of circuit uncertainties based on orthogonal polynomials

机译：基于正交多项式的电路不确定性的SPICE替代实现
- 作者：Manfredi Paolo;Stievano Igor S.;Canavero Flavio G.
- 会议名称：《2011 IEEE 20th Conference on Electrical Performance of Electronic Packaging and Systems》 | 2011年
- Circuit Simulation;
- Circuit modeling;
- Polynomial chaos;
- Stochastic analysis;
- Tolerance analysis;
- Transmission-lines;
- Uncertainty;
22.Sequential sampling strategy for the modeling of parameterized microwave and RF components

机译：用于参数化微波和射频组件建模的顺序采样策略
- 作者：Deschrijver Dirk;Crombecq Karel;Nguyen Huu Minh;Dhaene Tom
- 会议名称：《2011 IEEE 20th Conference on Electrical Performance of Electronic Packaging and Systems》 | 2011年
23.Fast rational function fitting of broadband multi-port responses via repeated random sampling

机译：通过重复随机采样对宽带多端口响应进行快速有理函数拟合
- 作者：Chung Joon Hyung;Cangellaris Andreas C.
- 会议名称：《2011 IEEE 20th Conference on Electrical Performance of Electronic Packaging and Systems》 | 2011年
- Repeated random sampling;
- Vector fitting;
- macromodeling;
24.A compression strategy for rational macromodeling of large interconnect structures

机译：大型互连结构的合理宏建模的压缩策略
- 作者：Grivet-Talocia S.;Olivadese S. B.;Triverio P.
- 会议名称：《2011 IEEE 20th Conference on Electrical Performance of Electronic Packaging and Systems》 | 2011年
25.Spectral relations of supply noise and jitter with regular and feed forward clocking schemes

机译：采用常规和前馈时钟方案的电源噪声和抖动的频谱关系
- 作者：Vikinski Omer
- 会议名称：《2011 IEEE 20th Conference on Electrical Performance of Electronic Packaging and Systems》 | 2011年
- clock distribution;
- feed forward;
- jitter;
- noise;
26.Extraction of jitter parameters from BER measurements

机译：从BER测量中提取抖动参数
- 作者：Aleksic Marko
- 会议名称：《》 | 2011年
- bit error rate;
- jitter;
- modeling;
- parameter extraction;
27.A methodology for RF modeling of packages using IC known-loads

机译：使用IC已知负载对封装进行RF建模的方法
- 作者：Ballicchia Mauro;Farina Marco;Morini Antonio;Rozzi Tullio;Turchetti Claudio;Orcioni Simone
- 会议名称：《2011 IEEE 20th Conference on Electrical Performance of Electronic Packaging and Systems》 | 2011年
- RFICs;
- de-embedding;
- modeling;
- package characterization;
28.Electrical performance of high speed signaling in coupled microstrip lines

机译：耦合微带线中高速信令的电性能
- 作者：Kostka Darryl;Scogna Antonio Ciccomancini;Paglia Frank;Mutnury Bhyrav
- 会议名称：《2011 IEEE 20th Conference on Electrical Performance of Electronic Packaging and Systems》 | 2011年
- differential signaling;
- high speed;
- signal integrity;
29.Optimized coplanar waveguides in membrane technology for wideband on-wafer calibrations

机译：膜技术中优化的共面波导，用于宽带晶圆上校准
- 作者：Arz Uwe;Rohland Martina;Kuhlmann Karsten;Buttgenbach Stephanus
- 会议名称：《2011 IEEE 20th Conference on Electrical Performance of Electronic Packaging and Systems》 | 2011年
30.New interconnect evaluation metric for high-speed IO

机译：针对高速IO的新互连评估指标
- 作者：Moon Se-Jung;Acar Erkan;Mellitz Richard
- 会议名称：《2011 IEEE 20th Conference on Electrical Performance of Electronic Packaging and Systems》 | 2011年
- RSM;
- design optimization;
- differential bus;
- high-speed IO;
- interconnect;
- spring-probe socket;
31.Distributed multi TSV 3D clock distribution network in TSV-based 3D IC

机译：基于TSV的3D IC中的分布式多TSV 3D时钟分配网络
- 作者：Kim Dayoung;Kim Joohee;Cho Jonghyun;Pak Jun So;Kim Joungho;Lee Hyungdong;Lee Junho;Park Kunwoo
- 会议名称：《2011 IEEE 20th Conference on Electrical Performance of Electronic Packaging and Systems》 | 2011年
32.Adaptive clock distribution for 3D integrated circuits

机译：3D集成电路的自适应时钟分配
- 作者：Chen Xi;Davis W Rhett;Franzon Paul D
- 会议名称：《2011 IEEE 20th Conference on Electrical Performance of Electronic Packaging and Systems》 | 2011年
- 3D IC;
- adaptive;
- clock distribution;
- de-skew;
33.Fast iterative simulation of high-speed channels via frequency-dependent over-relaxation

机译：通过频率相关的过松弛来快速仿真高速通道
- 作者：Hu H.;Chinea A.;Grivet-Talocia S.;Miscuglio M.
- 会议名称：《2011 IEEE 20th Conference on Electrical Performance of Electronic Packaging and Systems》 | 2011年
34.An analytical resistive loss model for multiconductor transmission lines and the proof of its passivity

机译：多导体传输线的分析性电阻损耗模型及其无源性证明
- 作者：Broyde Frederic;Clavelier Evelyne
- 会议名称：《2011 IEEE 20th Conference on Electrical Performance of Electronic Packaging and Systems》 | 2011年
- Multiconductor transmission lines;
- resistive loss model;
- signal integrity analysis;
35.Latency insertion method (LIM) for CMOS circuit simulations with multi-rate considerations

机译：考虑多速率因素的CMOS电路仿真的延迟插入方法（LIM）
- 作者：Goh Patrick;Schutt-Aine Jose E.
- 会议名称：《2011 IEEE 20th Conference on Electrical Performance of Electronic Packaging and Systems》 | 2011年
- CMOS;
- circuit simulation;
- latency insertion method (LIM);
- multi-rate simulation;
36.Simulations of pulse signals with X-parameters

机译：使用X参数模拟脉冲信号
- 作者：Huang Nick K. H.;Jiang Lijun
- 会议名称：《2011 IEEE 20th Conference on Electrical Performance of Electronic Packaging and Systems》 | 2011年
- Nonlinearity;
- X-parameters;
- polyharmonic distortion;
- pulse signal;
37.Design and analysis of 12.8 Gb/s single-ended signaling for memory interface

机译：存储器接口12.8 Gb / s单端信令的设计和分析
- 作者：Beyene W. T.;Amirkhany A.;Madden C.;Lan H.;Yang L.;Kaviani K.;Mukherjee S.;Secker D.;Schmitt R.
- 会议名称：《2011 IEEE 20th Conference on Electrical Performance of Electronic Packaging and Systems》 | 2011年
38.Embedded equalization for ADC-based serial I/O receivers

机译：基于ADC的串行I / O接收器的嵌入式均衡
- 作者：Shafik Ayman;Lee Keytaek;Tabasy Ehsan Zhian;Palermo Samuel
- 会议名称：《2011 IEEE 20th Conference on Electrical Performance of Electronic Packaging and Systems》 | 2011年
- ADC-based receiver;
- DFE;
- FFE;
- embedded equalization;
- statistical BER;
39.System design considerations for a 5Gb/s source-synchronous link with common-mode clocking

机译：具有共模时钟的5Gb / s源同步链路的系统设计注意事项
- 作者：Ren Jihong;Oh Dan;Kollipara Ravi;Tsang Brian;Lu Yue;Zerbe Jared;Lin Qi
- 会议名称：《2011 IEEE 20th Conference on Electrical Performance of Electronic Packaging and Systems》 | 2011年
- Common mode clocking;
- Source synchronous;
- mode conversion;
40.Interconnect channel characteristics favoring double-edge pulsewidth modulation

机译：互连通道特性有利于双沿脉宽调制
- 作者：Wang Wei;Buckwalter James F.
- 会议名称：《2011 IEEE 20th Conference on Electrical Performance of Electronic Packaging and Systems》 | 2011年
- Pulse width modulation;
- Serial I/O;
- Spectral analysis;
41.Macromodeling based variability analysis of an inverted embedded microstrip line

机译：反向嵌入式微带线基于宏建模的变异性分析
- 作者：Ginste Dries Vande;De Zutter Daniel;Deschrijver Dirk;Dhaene Tom;Canavero Flavio
- 会议名称：《2011 IEEE 20th Conference on Electrical Performance of Electronic Packaging and Systems》 | 2011年
42.Interconnect transient simulation in the presence of layout and routing uncertainty

机译：存在布局和布线不确定性时的互连瞬态仿真
- 作者：Rong Aosheng;Cangellaris Andreas C.
- 会议名称：《2011 IEEE 20th Conference on Electrical Performance of Electronic Packaging and Systems》 | 2011年
- interconnects;
- signal integrity;
- stochastic modeling;
43.Random rough surface effects in interconnects studied by small perturbation theory in waveguide model

机译：波导模型中小扰动理论研究互连中的随机粗糙表面效应
- 作者：Ding Ruihua;Tsang Leung;Braunisch Henning
- 会议名称：《2011 IEEE 20th Conference on Electrical Performance of Electronic Packaging and Systems》 | 2011年
- Random rough surface;
- enhancement factor;
- perturbation method;
- three dimensional;
- waveguide structure;
44.Towards system-level electromagnetic field simulation on computing clouds

机译：在计算云上进行系统级电磁场仿真
- 作者：Gope Dipanjan;Jandhyala Vikram;Wang Xiren;Macmillen Don;Camposano Raul;Chakraborty Swagato;Pingenot James;Williams Devan
- 会议名称：《2011 IEEE 20th Conference on Electrical Performance of Electronic Packaging and Systems》 | 2011年
- Electromagnetic (EM) and EM interference modeling;
- simulation algorithms;
- tools and flows;
45.Fast full-wave modeling of passive structures with graphic processors

机译：使用图形处理器对被动结构进行全波快速建模
- 作者：Chiariello Andrea G.;Maffucci A.;Villone F.;Nicolazzo Massimo
- 会议名称：《2011 IEEE 20th Conference on Electrical Performance of Electronic Packaging and Systems》 | 2011年
- CUDA;
- EFIE;
- GPU;
- full-wave modeling;
- interconnects;
46.Mixed integral-differential skin-effect models for PEEC electromagnetic solver

机译：PEEC电磁求解器的混合积分微分集肤效应模型
- 作者：Antonini Giulio;Ruehli Albert E.;Jiang Lijun
- 会议名称：《2011 IEEE 20th Conference on Electrical Performance of Electronic Packaging and Systems》 | 2011年
47.Full-wave PEEC time domain solver based on leapfrog scheme

机译：基于跳越方案的全波PEEC时域求解器
- 作者：Sekine Tadatoshi;Asai Hideki
- 会议名称：《2011 IEEE 20th Conference on Electrical Performance of Electronic Packaging and Systems》 | 2011年
48.An explicit and unconditionally stable time-domain finite-element method of linear complexity for electromagnetics-based simulation of 3-D global interconnect network

机译：基于线性复杂度的显式且无条件稳定的时域有限元方法，用于基于电磁的3-D全球互连网络仿真
- 作者：He Qing;Chen Duo;Jiao Dan
- 会议名称：《2011 IEEE 20th Conference on Electrical Performance of Electronic Packaging and Systems》 | 2011年
- explicit methods;
- linear complexity;
- unconditonally stable;
49.Accuracy-improved through-silicon-via model using conformal mapping technique

机译：使用保形映射技术提高了硅通孔模型的精度
- 作者：Cheng Tai-Yu;Wang Chuen-De;Chiou Yih-Peng;Wu Tzong-Lin
- 会议名称：《2011 IEEE 20th Conference on Electrical Performance of Electronic Packaging and Systems》 | 2011年
50.Modeling of ISI in high speed serial I/Os terminated with discontinuities

机译：以中断终止的高速串行I / O中的ISI建模
- 作者：Dey Aritra;Song Hong Jiang
- 会议名称：《2011 IEEE 20th Conference on Electrical Performance of Electronic Packaging and Systems》 | 2011年
- BER;
- CMOS;
- CRC;
- DDJ;
- Gbps;
- LTI;
- PLL;
51.SI-aware layout and equalizer design to enhance performance of high-speed links in blade servers

机译：支持SI的布局和均衡器设计可增强刀片服务器中高速链路的性能
- 作者：Cheng Yung-Shou;Lu Hsin-Hung;Chang Michael;Chang Stephen;Liu Bob;Wu Ruey-Beei
- 会议名称：《2011 IEEE 20th Conference on Electrical Performance of Electronic Packaging and Systems》 | 2011年
- Anti-pad;
- blade servers;
- contact pads;
- eaulizer;
- intersymbol interference;
- through-hole via;
- via stub;
52.Switching regulator noise coupled onto high speed differential links

机译：开关稳压器噪声耦合到高速差分链路
- 作者：Rodriguez Daniel;Chun Sungjun;Mandrekar Rohan;Dreps Daniel
- 会议名称：《2011 IEEE 20th Conference on Electrical Performance of Electronic Packaging and Systems》 | 2011年
- High-speed differetial link;
- eye opening;
- noise coupling;
- noise isolation;
- signal integrity;
- switching regulator;
53.Passive model-order reduction of RLC circuits with embedded time-delay descriptor systems

机译：具有嵌入式时延描述符系统的RLC电路的被动模型阶约化
- 作者：Charest Andrew;Nakhla Michel;Achar Ramachandra
- 会议名称：《2011 IEEE 20th Conference on Electrical Performance of Electronic Packaging and Systems》 | 2011年
54.A new method to estimate phases of sinusoidal jitter to evaluate high-speed links

机译：一种估计正弦抖动相位以评估高速链路的新方法
- 作者：Chang Yu;Madden Chris;Schmitt Ralf
- 会议名称：《2011 IEEE 20th Conference on Electrical Performance of Electronic Packaging and Systems》 | 2011年
- BER;
- jitter;
- phase;
- subspace;
- supply noise;
55.Electrical performance of inkjet printed flexible cable for ECG monitoring

机译：用于ECG监测的喷墨印刷软电缆的电气性能
- 作者：Wan Qiansu;Yang Geng;Chen Qiang;Zheng Li-Rong
- 会议名称：《2011 IEEE 20th Conference on Electrical Performance of Electronic Packaging and Systems》 | 2011年
- ECG monitoring;
- inkjet printed;
- shielding;
56.Decoupling capacitor stacked chip (DCSC) in TSV-based 3D-ICs

机译：基于TSV的3D-IC中的去耦电容器堆叠芯片（DCSC）
- 作者：Song Eunseok;Koo Kyoungchoul;Kim Myunghoi;Pak Jun So;Kim Joungho
- 会议名称：《2011 IEEE 20th Conference on Electrical Performance of Electronic Packaging and Systems》 | 2011年
57.A fine-grained co-simulation methodology for IR-drop noise in silicon interposer and TSV-based 3D IC

机译：硅中介层和基于TSV的3D IC中IR降噪声的细粒度联合仿真方法
- 作者：Song Taigon;Lim Sung Kyu
- 会议名称：《2011 IEEE 20th Conference on Electrical Performance of Electronic Packaging and Systems》 | 2011年
- 3D IC;
- Chip;
- Co-Analysis;
- Co-Simulation;
- IR-Drop;
- PCB;
- Package;
- Silicon Interposer;
58.High-frequency through-silicon Via (TSV) failure analysis

机译：高频硅通孔（TSV）故障分析
- 作者：Kim Joohee;Cho Jonghyun;Pak Jun So;Kim Joungho;Yook Jong-Min;Kim Jun Chul
- 会议名称：《2011 IEEE 20th Conference on Electrical Performance of Electronic Packaging and Systems》 | 2011年
- failure analysis;
- integrated circuit (3D IC);
- three-dimensional;
- through-silicon via (TSV);
59.Temperature-dependent through-silicon via (TSV) model and noise coupling

机译：温度相关的硅通孔（TSV）模型和噪声耦合
- 作者：Lee Manho;Cho Jonghyun;Kim Joohee;Pak Jun So;Kim Joungho;Lee Hyungdong;Lee Junho;Park Kunwoo
- 会议名称：《2011 IEEE 20th Conference on Electrical Performance of Electronic Packaging and Systems》 | 2011年
- 3D-IC;
- TSV-TSV coupling;
- dielectric constant;
- silicon resistivity;
- temperature-dependent TSV model;
- through silicon via(TSV);
60.Signal-integrity improvement based on the segmental-transmission-line

机译：基于分段传输线的信号完整性改善
- 作者：Shimada Hiroki;Akita Shohei;Ihiguro Masami;Yasunaga Moritoshi;Yoshihara Ikuo
- 会议名称：《2011 IEEE 20th Conference on Electrical Performance of Electronic Packaging and Systems》 | 2011年
- Differential Transmission Line;
- Eye diagram;
- Signal Integrity;
61.Waveform relaxation based analysis of noise propagation in power distribution networks

机译：基于波形松弛的配电网噪声传播分析
- 作者：Roy Sourajeet;Dounavis Anestis
- 会议名称：《2011 IEEE 20th Conference on Electrical Performance of Electronic Packaging and Systems》 | 2011年
- Convergence;
- delay extraction;
- power distribution networks;
- signal integrity;
- transmission lines;
- waveform relaxation;
62.Reduced circuit modeling of mother board and package for a system power delivery analysis

机译：简化了母板和封装的电路建模，可进行系统功率传输分析
- 作者：Koo Jayong;Pandit Vishram
- 会议名称：《2011 IEEE 20th Conference on Electrical Performance of Electronic Packaging and Systems》 | 2011年
- Macromodeling;
- Pi-network;
- network parameter;
- power delivery network;
63.Application of the latency insertion method to electro-thermal circuit analysis

机译：潜伏时间插入方法在电热回路分析中的应用
- 作者：Klokotov D.;Schutt-Aine J.;Beyene W.;Mullen D.;Li M.;Schmitt R.;Yang L.
- 会议名称：《2011 IEEE 20th Conference on Electrical Performance of Electronic Packaging and Systems》 | 2011年
- IR drop;
- circuit simulation;
- electro-thermal analysis;
- latency insertion;
- power integrity;
64.Analysis and approach of TSV-based hierarchical power distribution networks for estimating 1^st-Droop and resonant noise in 3DIC

机译：基于TSV的3DIC中估计^{st -Droop和谐振噪声的分层配电网络的分析和方法}
- 作者：Charles Gary;Franzon Paul D.;Kim Jaemin;Levin Alex
- 会议名称：《2011 IEEE 20th Conference on Electrical Performance of Electronic Packaging and Systems》 | 2011年
65.Design of power delivery networks using power transmission lines and pseudo-balanced signaling for multiple I/Os

机译：使用输电线路和多个I / O的伪平衡信令设计输电网络
- 作者：Huh Suzanne;Swaminathan Madhavan;Keezer David
- 会议名称：《2011 IEEE 20th Conference on Electrical Performance of Electronic Packaging and Systems》 | 2011年
- Power delivery network;
- balanced signaling;
- power transmission line;
- simultaneous switching noise;
66.Bended differential transmission line using short-circuited coupled line for common-mode noise suppression

机译：弯曲的差分传输线，使用短路耦合线抑制共模噪声
- 作者：Chang Chia-Han;Fang Ruei-Ying;Wang Chun-Long
- 会议名称：《2011 IEEE 20th Conference on Electrical Performance of Electronic Packaging and Systems》 | 2011年
- Compensation inductance;
- common-mode noise;
- coupled line;
- differential transmission line;
- shorted-end;
67.A comparison of two latency insertion methods in dependent sources applications

机译：依赖源应用程序中两种延迟插入方法的比较
- 作者：Liu Ping;Tan Jilin;Zhou Zhongyong;Schutt-Aine Jose;Goh Patrick
- 会议名称：《2011 IEEE 20th Conference on Electrical Performance of Electronic Packaging and Systems》 | 2011年
- amplification matrix LIM;
- dependent sources;
- latency insertion methods(LIM);
- scalar LIM;
68.Twelve pseudo-differential transmission schemes

机译：十二个伪差分传输方案
- 作者：Broyde Frederic;Clavelier Evelyne
- 会议名称：《2011 IEEE 20th Conference on Electrical Performance of Electronic Packaging and Systems》 | 2011年
- Parallel links;
- chip-to-chip interconnects;
- signal integrity;
69.Compact stepped-impedance resonator transformer

机译：紧凑型步进阻抗谐振变压器
- 作者：Fang Ruei-Ying;Liu Chia-Fen;Wang Chun-Long
- 会议名称：《2011 IEEE 20th Conference on Electrical Performance of Electronic Packaging and Systems》 | 2011年
70.Efficient spectral domain analysis of multilayered shielded microstrip using two super convergent series

机译：使用两个超收敛级数的多层屏蔽微带线高效光谱域分析
- 作者：Jain Sidharath;Song Jiming;Kamgaing Telesphor;Mekonnen Yidnekachew
- 会议名称：《2011 IEEE 20th Conference on Electrical Performance of Electronic Packaging and Systems》 | 2011年
- Shielded microstrip;
- infinite series summation;
- spectral domain immitance approach;