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IEEE Conference on Electrical Performance of Electronic Packaging and Systems

召开年：2013
召开地：San Jose, CA(US)
出版时间：-

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1.Improve storage IO performance by using 85Ohm package and motherboard routing

机译：通过使用85OHM包和主板路由来提高存储IO性能
- 作者：{missing}
- 会议名称：《IEEE Conference on Electrical Performance of Electronic Packaging and Systems》 | 2010年
- 85Ohm;
- SAS;
- SATA;
- electrical packaging;
- high speed signalling;
- interconnects;
- signal integrity;
2.Optimal signaling techniques for Through Silicon Vias in 3-D integrated circuit packages

机译：3-D集成电路封装中通过硅通孔的最佳信号技术
- 作者：{missing}
- 会议名称：《IEEE Conference on Electrical Performance of Electronic Packaging and Systems》 | 2010年
3.Low-cost antenna-in-package solutions for 60-GHz phased-array systems

机译：用于60-GHz相位阵列系统的低成本天线解决方案
- 作者：{missing}
- 会议名称：《IEEE Conference on Electrical Performance of Electronic Packaging and Systems》 | 2010年
- 60 GHz;
- Antenna-in-package;
- millimeter-wave package;
- phased-array antennas;
4.High speed DDR interface timing closure

机译：高速DDR接口定时闭合
- 作者：{missing}
- 会议名称：《IEEE Conference on Electrical Performance of Electronic Packaging and Systems》 | 2010年
- DDR3;
- SI;
- SSN;
- crosstalk;
5.Size and temperature effects on the resistance of copper and carbon nanotubes nano-interconnects

机译：铜和碳纳米管纳米互连电阻的尺寸和温度效应
- 作者：{missing}
- 会议名称：《IEEE Conference on Electrical Performance of Electronic Packaging and Systems》 | 2010年
- carbon nanotubes;
- interconnects;
- nanoelectronics;
6.On the choice of Laguerre parameter in nodal order reduction via bilinear conformal transformation

机译：通过双线性保形转化在节点阶减少中选择Laguerre参数的选择
- 作者：Narayanan T.V.;Swaminathan Madhavan
- 会议名称：《IEEE Conference on Electrical Performance of Electronic Packaging and Systems》 | 2010年
7.Time-domain convolution method for pad signal from pin signal measurement

机译：引脚信号测量的焊盘信号时域卷积方法
- 作者：Wallace Douglas E.
- 会议名称：《IEEE Conference on Electrical Performance of Electronic Packaging and Systems》 | 2010年
- Convolution;
- High-Speed Signal Measurement;
- MATLAB;
- Mathcad;
- SI;
- Simulation;
8.Driver design for DDR4 memory subsystems

机译：DDR4内存子系统的驱动程序设计
- 作者：{missing}
- 会议名称：《IEEE Conference on Electrical Performance of Electronic Packaging and Systems》 | 2010年
- DDR4;
- de-emphasis;
- driver design;
- pre-emphasis;
9.Multi-physics modeling of through-silicon vias with equivalent-circuit approach

机译：具有等效电路方法的通过硅通孔的多物理建模
- 作者：{missing}
- 会议名称：《IEEE Conference on Electrical Performance of Electronic Packaging and Systems》 | 2010年
10.Time-domain adjoint sensitivity of high-speed interconnects

机译：高速互连的时域伴随敏感性
- 作者：{missing}
- 会议名称：《IEEE Conference on Electrical Performance of Electronic Packaging and Systems》 | 2010年
- Circuit simulation;
- Coupled transmission lines;
- High-speed Interconnects;
- Sensitivity;
- Signal Integrity;
11.Analytical integration-based causality checking of tabulated S-parameters

机译：基于分析的集成的标记S参数的因果关系检查
- 作者：{missing}
- 会议名称：《IEEE Conference on Electrical Performance of Electronic Packaging and Systems》 | 2010年
- EM simulation algorithms;
- Macromodeling;
- data analysis techniques;
12.A compact, low-cost, and wide-band passive equalizer design using multi-layer PCB parasitics

机译：使用多层PCB寄生菌具有紧凑，低成本和宽带被动均衡器设计
- 作者：{missing}
- 会议名称：《IEEE Conference on Electrical Performance of Electronic Packaging and Systems》 | 2010年
- Frequency-dependent Loss;
- Inter-symbol Interference (ISI);
- Parasitic Inductance;
- Passive Equalizer;
- Wideband Equalization;
13.DC IR drop solver for large scale 3D power delivery networks

机译：DC IR DROP求解器用于大型3D电源传递网络
- 作者：Xie Jianyong;Swaminathan Madhavan
- 会议名称：《IEEE Conference on Electrical Performance of Electronic Packaging and Systems》 | 2010年
- DC IR drop;
- conjugate gradient (CG) method;
- finite volume method;
- preconditioner;
- thourgh silicon via (TSV);
14.RC passive equalizer for through silicon via

机译：RC无源均衡器通过硅通孔
- 作者：{missing}
- 会议名称：《IEEE Conference on Electrical Performance of Electronic Packaging and Systems》 | 2010年
- Equalizer;
- through silicon via (TSV);
15.Power efficiency modeling and optimization of high-speed equalized-electrical I/O architectures

机译：高速均衡电气I / O架构的功率效率建模与优化
- 作者：Palaniappan Arun;Palermo Samuel
- 会议名称：《IEEE Conference on Electrical Performance of Electronic Packaging and Systems》 | 2010年
- Electrical Interconnects;
- High-Speed I/O Link;
- Power Efficiency Modeling and Optimization;
16.Peak-to-peak switching noise and LC resonance on a power distribution TSV pair

机译：配电TSV对上的峰 - 峰开关噪声和LC谐振
- 作者：{missing}
- 会议名称：《IEEE Conference on Electrical Performance of Electronic Packaging and Systems》 | 2010年
- 3D stack of ICs;
- LC resonance;
- peak-to-peak noise;
17.Optimized waveform relaxation solution of electromagnetic and circuit problems

机译：优化的电磁和电路问题波形释放解决方案
- 作者：Gander Martin J.;Ruehli Albert E.
- 会议名称：《IEEE Conference on Electrical Performance of Electronic Packaging and Systems》 | 2010年
18.Chip-package-board co-design for complex system-on-chip (SoC)

机译：复杂系统（SOC）的芯片包装板共同设计
- 作者：{missing}
- 会议名称：《IEEE Conference on Electrical Performance of Electronic Packaging and Systems》 | 2010年
- BGA;
- Bump placement;
- Floorplan;
- IR drop;
19.A new bandstop filter using artificial defected ground structures with compact size and low radiation

机译：一种新的BandStop过滤器，使用具有紧凑尺寸和低辐射的人工缺陷的地面结构
- 作者：{missing}
- 会议名称：《IEEE Conference on Electrical Performance of Electronic Packaging and Systems》 | 2010年
- bandstop filter;
- defected ground structure (DGS);
- patterned ground structure;
- radiation;
- size reduction;
20.An empirical study of performance and power scaling of low voltage DDR3

机译：低压DDR3性能和功率缩放的实证研究
- 作者：{missing}
- 会议名称：《IEEE Conference on Electrical Performance of Electronic Packaging and Systems》 | 2010年
- DDR3;
- DDR3L;
- average power;
- performance scaling;
- self-refresh power;
- signal integrity;
- thermal design power;
21.Electrical and physical parametric study of high-speed link performance

机译：高速链路性能的电气和物理参数研究
- 作者：{missing}
- 会议名称：《IEEE Conference on Electrical Performance of Electronic Packaging and Systems》 | 2010年
22.3-D full-package signal integrity analysis using domain decomposition method

机译：3-D全包信号完整性分析使用域分解方法
- 作者：{missing}
- 会议名称：《IEEE Conference on Electrical Performance of Electronic Packaging and Systems》 | 2010年
23.Symbolic macromodeling of parameterized S-parameter frequency responses

机译：参数化S参数频率响应的符号宏观耦合
- 作者：Deschrijver Dirk;Dhaene Tom
- 会议名称：《IEEE Conference on Electrical Performance of Electronic Packaging and Systems》 | 2010年
24.A zero power consumption Multi-Capacitor structure for voltage summing in high-speed FFE

机译：高速FFE电压求和的零功耗多电容器结构
- 作者：{missing}
- 会议名称：《IEEE Conference on Electrical Performance of Electronic Packaging and Systems》 | 2010年
- low-power equalization;
- package technology;
25.I/O power estimation and analysis of high-speed channels in through-silicon via (TSV)-based 3D IC

机译：基于硅通孔（TSV）3D IC的高速通道的I / O功率估算和分析
- 作者：{missing}
- 会议名称：《IEEE Conference on Electrical Performance of Electronic Packaging and Systems》 | 2010年
26.AC operation of high performance glass ceramic package interconnect and impact on manufacturing

机译：高性能玻璃陶瓷包互连的AC操作和对制造的影响
- 作者：{missing}
- 会议名称：《IEEE Conference on Electrical Performance of Electronic Packaging and Systems》 | 2010年
27.Parametric model order reduction from measurements

机译：参数模型顺序减少测量
- 作者：{missing}
- 会议名称：《IEEE Conference on Electrical Performance of Electronic Packaging and Systems》 | 2010年
28.A passivity enforcement algorithm for multiconductor transmission line based on the method of characteristics

机译：基于特征方法的多导体传输线的传输算法
- 作者：{missing}
- 会议名称：《IEEE Conference on Electrical Performance of Electronic Packaging and Systems》 | 2010年
- MoC;
- passivity;
- quadratic programming;
29.A novel clustering scheme for reduced-order macromodeling of massively coupled interconnect structures

机译：用于大型耦合互连结构的降低宏观调节的一种新型聚类方案
- 作者：{missing}
- 会议名称：《IEEE Conference on Electrical Performance of Electronic Packaging and Systems》 | 2010年
30.A rigorous method for fundamentally eliminating the low-frequency breakdown in full-wave finite-element-based analysis: Combined dielectric-conductor case

机译：一种严格的方法，基本上消除了基于全波有限元分析的低频故障：组合电介质导体壳体
- 作者：Zhu Jianfang;Jiao Dan
- 会议名称：《IEEE Conference on Electrical Performance of Electronic Packaging and Systems》 | 2010年
- Low-frequency breakdown;
- electromagnetic analysis;
- finite element methods;
- full-wave analysis;
31.Physically-consistent broadband material models for transmission lines on FR-4

机译：用于FR-4上的输电线路的物理 - 一致的宽带材料模型
- 作者：Wells Lionelle F.;Melde Kathleen L.
- 会议名称：《IEEE Conference on Electrical Performance of Electronic Packaging and Systems》 | 2010年
- Data Analysis Techniques;
- Electromagnetic Modeling;
- Electronic Packages;
32.Improvements of time-domain transmission waveform and eye diagram of serpentine delay line using guard trace stubs in stripline structure

机译：使用防护线结构防护迹线锯齿延迟线时域传输波形和眼图的改进
- 作者：{missing}
- 会议名称：《IEEE Conference on Electrical Performance of Electronic Packaging and Systems》 | 2010年
- Signal integrity(SI);
- eye diagram;
- guard trace;
- guard trace stub;
- serpentine delay line;
- time-domain transmission (TDT);
33.Modeling of multilayered media using effective medium theory

机译：利用有效媒体理论建模多层介质
- 作者：{missing}
- 会议名称：《IEEE Conference on Electrical Performance of Electronic Packaging and Systems》 | 2010年
34.Wide-range closed-form eddy-current loss formula for metal fill

机译：金属填充的宽范围闭合涡流损耗配方
- 作者：{missing}
- 会议名称：《IEEE Conference on Electrical Performance of Electronic Packaging and Systems》 | 2010年
- eddy-current loss;
- interconnects;
- metal fill;
- modeling;
35.Method to determine optimum equalization for maximum eye in high-speed computer system

机译：确定高速计算机系统最大眼睛最佳均衡的方法
- 作者：{missing}
- 会议名称：《IEEE Conference on Electrical Performance of Electronic Packaging and Systems》 | 2010年
- Feed Forward Equalization (FFE);
- eye opening;
- high-speed differetial link;
- signal integrity;
36.Noise verification techniques for the mixed-signal chip/package/board of digital TV systems

机译：用于混合信号芯片/包装/数字电视系统板的噪声验证技术
- 作者：{missing}
- 会议名称：《IEEE Conference on Electrical Performance of Electronic Packaging and Systems》 | 2010年
- co-design;
- co-simulation;
- mixed-signal;
- noise design;
- noise verification;
37.Through silicon via (TSV) shielding structures

机译：通过硅通孔（TSV）屏蔽结构
- 作者：{missing}
- 会议名称：《IEEE Conference on Electrical Performance of Electronic Packaging and Systems》 | 2010年
- TSV-TSV coupling;
- coupling suppression;
- guard ring;
- noise coupling;
- shielding TSV;
- shielding structure;
- through silicon via (TSV);
38.Modeling and simulation of high speed I/O links using X parameters

机译：使用X参数的高速I / O链路的建模与仿真
- 作者：{missing}
- 会议名称：《IEEE Conference on Electrical Performance of Electronic Packaging and Systems》 | 2010年
- Nonlinear vector network analyzer;
- X-parameters;
- polyharmonic distortion;
- scattering waves;
39.Exploring the rogue wave phenomenon in 3D power distribution networks

机译：探索三维配电网络中的流氓波现象
- 作者：{missing}
- 会议名称：《IEEE Conference on Electrical Performance of Electronic Packaging and Systems》 | 2010年
40.Multi-Gbit I/O and interconnect co-design for power efficient links

机译：多Gbit I / O和互连Co-Design用于功率有效链路
- 作者：{missing}
- 会议名称：《IEEE Conference on Electrical Performance of Electronic Packaging and Systems》 | 2010年
- HDI;
- area array connectors;
- flex;
- micro-twinax cable;
- power efficient I/O;
- top of the package interconnects;
41.A parallel Vector Fitting implementation for fast macromodeling of highly complex interconnects

机译：一种平行矢量拟合实现，适用于高度复杂的互连的快速宏观调
- 作者：Chinea A.;Grivet-Talocia S.
- 会议名称：《IEEE Conference on Electrical Performance of Electronic Packaging and Systems》 | 2010年
42.A methodology for RF modeling of packages using IC known-loads

机译：使用IC已知负载的封装RF建模方法
- 作者：Ballicchia Mauro;Farina Marco;Morini Antonio;Rozzi Tullio;Turchetti Claudio;Orcioni Simone
- 会议名称：《IEEE Conference on Electrical Performance of Electronic Packaging and Systems》 | 2011年
- RFICs;
- de-embedding;
- modeling;
- package characterization;
43.Switching regulator noise coupled onto high speed differential links

机译：切换稳压器噪声耦合到高速差动链路上
- 作者：Rodriguez Daniel;Chun Sungjun;Mandrekar Rohan;Dreps Daniel
- 会议名称：《IEEE Conference on Electrical Performance of Electronic Packaging and Systems》 | 2011年
- High-speed differetial link;
- eye opening;
- noise coupling;
- noise isolation;
- signal integrity;
- switching regulator;
44.Spectral relations of supply noise and jitter with regular and feed forward clocking schemes

机译：具有常规和馈送前进时钟的供给噪声和抖动的光谱关系
- 作者：Vikinski Omer
- 会议名称：《IEEE Conference on Electrical Performance of Electronic Packaging and Systems》 | 2011年
- clock distribution;
- feed forward;
- jitter;
- noise;
45.SI-aware layout and equalizer design to enhance performance of high-speed links in blade servers

机译：SI感知布局和均衡器设计，以提高刀片服务器中高速链路的性能
- 作者：Cheng Yung-Shou;Lu Hsin-Hung;Chang Michael;Chang Stephen;Liu Bob;Wu Ruey-Beei
- 会议名称：《IEEE Conference on Electrical Performance of Electronic Packaging and Systems》 | 2011年
- Anti-pad;
- blade servers;
- contact pads;
- eaulizer;
- intersymbol interference;
- through-hole via;
- via stub;
46.Wireless RF data communications using 60 GHz antennas in Multi-Core systems

机译：在多核系统中使用60 GHz天线的无线RF数据通信
- 作者：Yeh Ho-Hsin;Hiramatsu Nobuki;Melde Kathleen L.
- 会议名称：《IEEE Conference on Electrical Performance of Electronic Packaging and Systems》 | 2011年
47.An explicit and unconditionally stable time-domain finite-element method of linear complexity for electromagnetics-based simulation of 3-D global interconnect network

机译：三维全球互连网络电磁基础仿真线性复杂性的明确且无条件稳定的时域有限元方法
- 作者：He Qing;Chen Duo;Jiao Dan
- 会议名称：《IEEE Conference on Electrical Performance of Electronic Packaging and Systems》 | 2011年
- explicit methods;
- linear complexity;
- unconditonally stable;
48.Fast full-wave modeling of passive structures with graphic processors

机译：具有图形处理器的无源结构的快速全波模型
- 作者：Chiariello Andrea G.;Maffucci A.;Villone F.;Nicolazzo Massimo
- 会议名称：《IEEE Conference on Electrical Performance of Electronic Packaging and Systems》 | 2011年
- CUDA;
- EFIE;
- GPU;
- full-wave modeling;
- interconnects;
49.New interconnect evaluation metric for high-speed IO

机译：高速IO的新互连评估度量
- 作者：Moon Se-Jung;Acar Erkan;Mellitz Richard
- 会议名称：《IEEE Conference on Electrical Performance of Electronic Packaging and Systems》 | 2011年
- RSM;
- design optimization;
- differential bus;
- high-speed IO;
- interconnect;
- spring-probe socket;
50.Twelve pseudo-differential transmission schemes

机译：十二个伪差分传输方案
- 作者：Broyde Frederic;Clavelier Evelyne
- 会议名称：《IEEE Conference on Electrical Performance of Electronic Packaging and Systems》 | 2011年
- Parallel links;
- chip-to-chip interconnects;
- signal integrity;
51.Macromodeling based variability analysis of an inverted embedded microstrip line

机译：基于Macromodeling的倒置嵌入式微带线的可变性分析
- 作者：Ginste Dries Vande;De Zutter Daniel;Deschrijver Dirk;Dhaene Tom;Canavero Flavio
- 会议名称：《IEEE Conference on Electrical Performance of Electronic Packaging and Systems》 | 2011年
52.Extraction of jitter parameters from BER measurements

机译：从BER测量提取抖动参数
- 作者：Aleksic Marko
- 会议名称：《IEEE Conference on Electrical Performance of Electronic Packaging and Systems》 | 2011年
- bit error rate;
- jitter;
- modeling;
- parameter extraction;
53.Alternative SPICE implementation of circuit uncertainties based on orthogonal polynomials

机译：基于正交多项式的电路不确定性的替代Spice实现
- 作者：Manfredi Paolo;Stievano Igor S.;Canavero Flavio G.
- 会议名称：《IEEE Conference on Electrical Performance of Electronic Packaging and Systems》 | 2011年
- Circuit Simulation;
- Circuit modeling;
- Polynomial chaos;
- Stochastic analysis;
- Tolerance analysis;
- Transmission-lines;
- Uncertainty;
54.Reduced circuit modeling of mother board and package for a system power delivery analysis

机译：减少母板的电路建模和系统电力传递分析的包装
- 作者：Koo Jayong;Pandit Vishram
- 会议名称：《IEEE Conference on Electrical Performance of Electronic Packaging and Systems》 | 2011年
- Macromodeling;
- Pi-network;
- network parameter;
- power delivery network;
55.Optimized coplanar waveguides in membrane technology for wideband on-wafer calibrations

机译：宽带晶圆校准膜技术中的优化共面波导
- 作者：Arz Uwe;Rohland Martina;Kuhlmann Karsten;Buttgenbach Stephanus
- 会议名称：《IEEE Conference on Electrical Performance of Electronic Packaging and Systems》 | 2011年
56.Design and analysis of 12.8 Gb/s single-ended signaling for memory interface

机译：设计与分析12.8 GB / s单端信令的存储器接口
- 作者：Beyene W. T.;Amirkhany A.;Madden C.;Lan H.;Yang L.;Kaviani K.;Mukherjee S.;Secker D.;Schmitt R.
- 会议名称：《IEEE Conference on Electrical Performance of Electronic Packaging and Systems》 | 2011年
57.Electrical performance of high speed signaling in coupled microstrip lines

机译：耦合微带线路高速信令的电性能
- 作者：Kostka Darryl;Scogna Antonio Ciccomancini;Paglia Frank;Mutnury Bhyrav
- 会议名称：《IEEE Conference on Electrical Performance of Electronic Packaging and Systems》 | 2011年
- differential signaling;
- high speed;
- signal integrity;
58.Through-silicon via (TSV) depletion effect

机译：通过硅通孔（TSV）耗尽效应
- 作者：Cho Jonghyun;Kim Myunghoi;Kim Joohee;Pak Jun So;Kim Joungho;Lee Hyungdong;Lee Junho;Park Kunwoo
- 会议名称：《IEEE Conference on Electrical Performance of Electronic Packaging and Systems》 | 2011年
- TSV coupling;
- depletion;
- distortion;
- large signal;
- measurement;
- nonlinearity;
- through-silicon via (TSV);
59.Modeling of ISI in high speed serial I/Os terminated with discontinuities

机译：在高速串行I / O中的ISI建模终止了不连续性
- 作者：Dey Aritra;Song Hong Jiang
- 会议名称：《IEEE Conference on Electrical Performance of Electronic Packaging and Systems》 | 2011年
- BER;
- CMOS;
- CRC;
- DDJ;
- Gbps;
- LTI;
- PLL;
60.Decoupling capacitor stacked chip (DCSC) in TSV-based 3D-ICs

机译：基于TSV的3D-IC中的去耦电容堆叠芯片（DCSC）
- 作者：Song Eunseok;Koo Kyoungchoul;Kim Myunghoi;Pak Jun So;Kim Joungho
- 会议名称：《IEEE Conference on Electrical Performance of Electronic Packaging and Systems》 | 2011年
61.Efficient spectral domain analysis of multilayered shielded microstrip using two super convergent series

机译：一种使用两个超级收敛系列多层屏蔽微带的高效光谱域分析
- 作者：Jain Sidharath;Song Jiming;Kamgaing Telesphor;Mekonnen Yidnekachew
- 会议名称：《IEEE Conference on Electrical Performance of Electronic Packaging and Systems》 | 2011年
- Shielded microstrip;
- infinite series summation;
- spectral domain immitance approach;
62.High-density silicon carrier transmission line design for chip-to-chip interconnects

机译：用于芯片到芯片互连的高密度硅载体传输线路设计
- 作者：Gu Xiaoxiong;Turlapati Lavanya;Dang Bing;Tsang Cornelia K.;Andry Paul S.;Dickson Timothy O.;Beakes Michael P.;Knickerbocker John U.;Friedman Daniel J.
- 会议名称：《IEEE Conference on Electrical Performance of Electronic Packaging and Systems》 | 2011年
- electrical interconnect;
- signal integrity;
- silicon carrier;
- transmission line;
63.System design considerations for a 5Gb/s source-synchronous link with common-mode clocking

机译：具有共模时钟的5GB / S源同步链路的系统设计注意事项
- 作者：Ren Jihong;Oh Dan;Kollipara Ravi;Tsang Brian;Lu Yue;Zerbe Jared;Lin Qi
- 会议名称：《IEEE Conference on Electrical Performance of Electronic Packaging and Systems》 | 2011年
- Common mode clocking;
- Source synchronous;
- mode conversion;
64.Common-mode noise reduction schemes for differential serpentine delay microstrip line in high-speed digital circuits

机译：用于高速数字电路中差分蛇形延迟微带线的共模噪声降低方案
- 作者：Shiue Guang-Hwa;Tsai Yi-Chin;Hsu Che-Ming;Shiu Jia-Hung
- 会议名称：《IEEE Conference on Electrical Performance of Electronic Packaging and Systems》 | 2011年
- common-mode noise;
- differential serpentine delay line;
- differential-to-common mode conversion;
65.Compact stepped-impedance resonator transformer

机译：紧凑型步进阻抗谐振器变压器
- 作者：Fang Ruei-Ying;Liu Chia-Fen;Wang Chun-Long
- 会议名称：《IEEE Conference on Electrical Performance of Electronic Packaging and Systems》 | 2011年
66.Embedded equalization for ADC-based serial I/O receivers

机译：基于ADC的串行I / O接收器的嵌入式均衡
- 作者：Shafik Ayman;Lee Keytaek;Tabasy Ehsan Zhian;Palermo Samuel
- 会议名称：《IEEE Conference on Electrical Performance of Electronic Packaging and Systems》 | 2011年
- ADC-based receiver;
- DFE;
- FFE;
- embedded equalization;
- statistical BER;
67.An analytical resistive loss model for multiconductor transmission lines and the proof of its passivity

机译：用于多导体传输线的分析电阻损耗模型及其定性证明
- 作者：Broyde Frederic;Clavelier Evelyne
- 会议名称：《IEEE Conference on Electrical Performance of Electronic Packaging and Systems》 | 2011年
- Multiconductor transmission lines;
- resistive loss model;
- signal integrity analysis;
68.Latency insertion method (LIM) for CMOS circuit simulations with multi-rate considerations

机译：具有多速率考虑的CMOS电路模拟的延迟插入方法（LIM）
- 作者：Goh Patrick;Schutt-Aine Jose E.
- 会议名称：《IEEE Conference on Electrical Performance of Electronic Packaging and Systems》 | 2011年
- CMOS;
- circuit simulation;
- latency insertion method (LIM);
- multi-rate simulation;
69.High-frequency through-silicon Via (TSV) failure analysis

机译：高频通过硅通孔（TSV）失效分析
- 作者：Kim Joohee;Cho Jonghyun;Pak Jun So;Kim Joungho;Yook Jong-Min;Kim Jun Chul
- 会议名称：《IEEE Conference on Electrical Performance of Electronic Packaging and Systems》 | 2011年
- failure analysis;
- integrated circuit (3D IC);
- three-dimensional;
- through-silicon via (TSV);
70.Capacitance calculation for a shared-antipad via structure using an integral equation method based on partial capacitance

机译：基于局部电容的整体方程方法，通过结构对共享 - 反馈的电容计算
- 作者：Wang Hanfeng;Ruehli Albert E.;Fan Jun
- 会议名称：《IEEE Conference on Electrical Performance of Electronic Packaging and Systems》 | 2011年
- integral equation method;
- partial capacitance;
- shared-antipad via structure;
- via-plane capacitance;
71.Accuracy-improved through-silicon-via model using conformal mapping technique

机译：使用保形映射技术精确改进的通过模型改进
- 作者：Cheng Tai-Yu;Wang Chuen-De;Chiou Yih-Peng;Wu Tzong-Lin
- 会议名称：《IEEE Conference on Electrical Performance of Electronic Packaging and Systems》 | 2011年
72.Waveform relaxation and overlapping partitioning techniques for tightly coupled interconnects

机译：用于紧密耦合互连的波形松弛和重叠分区技术
- 作者：Farhan Mina;Nakhla Natalie;Nakhla Michel;Achar Ram;Ruehliy Albert
- 会议名称：《IEEE Conference on Electrical Performance of Electronic Packaging and Systems》 | 2011年
73.Simulations of pulse signals with X-parameters

机译：X参数模拟脉冲信号
- 作者：Huang Nick K. H.;Jiang Lijun
- 会议名称：《IEEE Conference on Electrical Performance of Electronic Packaging and Systems》 | 2011年
- Nonlinearity;
- X-parameters;
- polyharmonic distortion;
- pulse signal;
74.High-speed performance of Silicon Bridge die-to-die interconnects

机译：硅桥芯片到模具互连的高速性能
- 作者：Braunisch Henning;Aleksov Aleksandar;Lotz Stefanie;Swan Johanna
- 会议名称：《IEEE Conference on Electrical Performance of Electronic Packaging and Systems》 | 2011年
- 3D interconnects;
- 3D packages;
- electronic packages;
- high-speed channels;
- multiconductor transmission lines;
- signal integrity;
75.Mixed integral-differential skin-effect models for PEEC electromagnetic solver

机译：PEEC电磁求解器的混合整体差分肌肤效果模型
- 作者：Antonini Giulio;Ruehli Albert E.;Jiang Lijun
- 会议名称：《IEEE Conference on Electrical Performance of Electronic Packaging and Systems》 | 2011年
76.Adaptive clock distribution for 3D integrated circuits

机译：3D集成电路的自适应时钟分配
- 作者：Chen Xi;Davis W Rhett;Franzon Paul D
- 会议名称：《IEEE Conference on Electrical Performance of Electronic Packaging and Systems》 | 2011年
- 3D IC;
- adaptive;
- clock distribution;
- de-skew;
77.A comparison of two latency insertion methods in dependent sources applications

机译：依赖源应用中的两个延迟插入方法的比较
- 作者：Liu Ping;Tan Jilin;Zhou Zhongyong;Schutt-Aine Jose;Goh Patrick
- 会议名称：《IEEE Conference on Electrical Performance of Electronic Packaging and Systems》 | 2011年
- amplification matrix LIM;
- dependent sources;
- latency insertion methods(LIM);
- scalar LIM;
78.Deriving voltage tolerance specification for processor circuit design

机译：用于处理器电路设计的电压公差规范
- 作者：Zhou Tingdong;Friedrich Joshua D.;Becker Wiren D.
- 会议名称：《IEEE Conference on Electrical Performance of Electronic Packaging and Systems》 | 2011年
- Power integrity;
- voltage tolerance specification;
79.Early stage chip/package/board co-design techniques for system-on-chip

机译：早期芯片/封装/板式芯片的共同设计技术
- 作者：Tanaka Mikiko Sode;Toyama Masahiro;Mori Ryo;Nakashima Hidenari;Haida Masahiro;Ooshima Izumi
- 会议名称：《IEEE Conference on Electrical Performance of Electronic Packaging and Systems》 | 2011年
- IR-drop;
- co-design;
- co-simulation;
80.Towards system-level electromagnetic field simulation on computing clouds

机译：朝着计算云系统级电磁场仿真
- 作者：Gope Dipanjan;Jandhyala Vikram;Wang Xiren;Macmillen Don;Camposano Raul;Chakraborty Swagato;Pingenot James;Williams Devan
- 会议名称：《IEEE Conference on Electrical Performance of Electronic Packaging and Systems》 | 2011年
- Electromagnetic (EM) and EM interference modeling;
- simulation algorithms;
- tools and flows;
81.Fast rational function fitting of broadband multi-port responses via repeated random sampling

机译：通过重复随机抽样的宽带多端口响应的快速合理功能拟合
- 作者：Chung Joon Hyung;Cangellaris Andreas C.
- 会议名称：《IEEE Conference on Electrical Performance of Electronic Packaging and Systems》 | 2011年
- Repeated random sampling;
- Vector fitting;
- macromodeling;
82.Waveform relaxation based analysis of noise propagation in power distribution networks

机译：基于波形放松的配电网络噪声传播分析
- 作者：Roy Sourajeet;Dounavis Anestis
- 会议名称：《IEEE Conference on Electrical Performance of Electronic Packaging and Systems》 | 2011年
- Convergence;
- delay extraction;
- power distribution networks;
- signal integrity;
- transmission lines;
- waveform relaxation;
83.Practical aspects of modeling apertures for signal and power integrity co-simulation

机译：信号和功率完整性共同仿真孔径建模的实用方面
- 作者：Choi Jae Young;Swaminathan Madhavan
- 会议名称：《IEEE Conference on Electrical Performance of Electronic Packaging and Systems》 | 2011年
- microstrip line;
- power distribution network;
- power integrity;
- return path discontinuity;
- signal integrity;
84.CAD model reconstruction of solder balls for the computationally efficient electromagnetic field simulation

机译：计算有效电磁场模拟的焊球CAD模型重建
- 作者：Hillebrand Jurgen;Kiess Steffen;Wang Yu;Wroblewski Marek;Simon Sven
- 会议名称：《IEEE Conference on Electrical Performance of Electronic Packaging and Systems》 | 2011年
- CAD model;
- Computed tomography;
- electromagnetic field simulation;
- scattering parameters;
85.Analysis and approach of TSV-based hierarchical power distribution networks for estimating 1st-Droop and resonant noise in 3DIC

机译：基于TSV的分层配电网络的分析与方法，用于估计1 st -droop和谐振噪声3d
- 作者：Charles Gary;Franzon Paul D.;Kim Jaemin;Levin Alex
- 会议名称：《IEEE Conference on Electrical Performance of Electronic Packaging and Systems》 | 2011年
86.Sequential sampling strategy for the modeling of parameterized microwave and RF components

机译：参数化微波和RF组件建模的顺序采样策略
- 作者：Deschrijver Dirk;Crombecq Karel;Nguyen Huu Minh;Dhaene Tom
- 会议名称：《IEEE Conference on Electrical Performance of Electronic Packaging and Systems》 | 2011年
87.A compression strategy for rational macromodeling of large interconnect structures

机译：大型互连结构的合理宏观调节的压缩策略
- 作者：Grivet-Talocia S.;Olivadese S. B.;Triverio P.
- 会议名称：《IEEE Conference on Electrical Performance of Electronic Packaging and Systems》 | 2011年
88.Passive model-order reduction of RLC circuits with embedded time-delay descriptor systems

机译：具有嵌入式时滞描述符系统的RLC电路的被动模型顺序减少
- 作者：Charest Andrew;Nakhla Michel;Achar Ramachandra
- 会议名称：《IEEE Conference on Electrical Performance of Electronic Packaging and Systems》 | 2011年
89.A de-embedding method for extracting S-parameters of vertical interconnect in advanced packaging

机译：提取高级封装垂直互连S参数的去嵌入方法
- 作者：Chang Yin-Cheng;Hsu Shawn S. H.;Chang Da-Chiang;Lee Jeng-Hung;Lin Shuw-Guann;Juang Ying-Zong
- 会议名称：《IEEE Conference on Electrical Performance of Electronic Packaging and Systems》 | 2011年
- TSVs;
- bump;
- de-embedding;
- extraction;
- interconnect;
90.Signal-integrity improvement based on the segmental-transmission-line

机译：基于分段传输线的信号完整性改进
- 作者：Shimada Hiroki;Akita Shohei;Ihiguro Masami;Yasunaga Moritoshi;Yoshihara Ikuo
- 会议名称：《IEEE Conference on Electrical Performance of Electronic Packaging and Systems》 | 2011年
- Differential Transmission Line;
- Eye diagram;
- Signal Integrity;
91.Design of a 12Gb/s transceiver for high-density links with discontinuities using modal signaling

机译：使用模态信令设计12GB / s收发器，具有不连续性的不连续性的高密度链路
- 作者：Milosevic Pavle;Schutt-Aine Jose E.
- 会议名称：《IEEE Conference on Electrical Performance of Electronic Packaging and Systems》 | 2011年
- Crosstalk mitigation;
- high-speed;
- modal decomposition;
- signaling;
92.Application of the latency insertion method to electro-thermal circuit analysis

机译：延迟插入方法在电热电路分析中的应用
- 作者：Klokotov D.;Schutt-Aine J.;Beyene W.;Mullen D.;Li M.;Schmitt R.;Yang L.
- 会议名称：《IEEE Conference on Electrical Performance of Electronic Packaging and Systems》 | 2011年
- IR drop;
- circuit simulation;
- electro-thermal analysis;
- latency insertion;
- power integrity;
93.Design of power delivery networks using power transmission lines and pseudo-balanced signaling for multiple I/Os

机译：使用电力传输线和多个I / O的伪平衡信令设计电力传递网络
- 作者：Huh Suzanne;Swaminathan Madhavan;Keezer David
- 会议名称：《IEEE Conference on Electrical Performance of Electronic Packaging and Systems》 | 2011年
- Power delivery network;
- balanced signaling;
- power transmission line;
- simultaneous switching noise;
94.Electrical performance of inkjet printed flexible cable for ECG monitoring

机译：喷墨印刷柔性电缆的电气性能，用于心电图监控
- 作者：Wan Qiansu;Yang Geng;Chen Qiang;Zheng Li-Rong
- 会议名称：《IEEE Conference on Electrical Performance of Electronic Packaging and Systems》 | 2011年
- ECG monitoring;
- inkjet printed;
- shielding;
95.Temperature-dependent through-silicon via (TSV) model and noise coupling

机译：温度依赖于硅通孔（TSV）模型和噪声耦合
- 作者：Lee Manho;Cho Jonghyun;Kim Joohee;Pak Jun So;Kim Joungho;Lee Hyungdong;Lee Junho;Park Kunwoo
- 会议名称：《IEEE Conference on Electrical Performance of Electronic Packaging and Systems》 | 2011年
- 3D-IC;
- TSV-TSV coupling;
- dielectric constant;
- silicon resistivity;
- temperature-dependent TSV model;
- through silicon via(TSV);
96.Random rough surface effects in interconnects studied by small perturbation theory in waveguide model

机译：波导模型中小扰动理论研究的互连中随机粗糙表面效应
- 作者：Ding Ruihua;Tsang Leung;Braunisch Henning
- 会议名称：《IEEE Conference on Electrical Performance of Electronic Packaging and Systems》 | 2011年
- Random rough surface;
- enhancement factor;
- perturbation method;
- three dimensional;
- waveguide structure;
97.Distributed multi TSV 3D clock distribution network in TSV-based 3D IC

机译：基于TSV的3D IC中的分布式多TSV 3D时钟分配网络
- 作者：Kim Dayoung;Kim Joohee;Cho Jonghyun;Pak Jun So;Kim Joungho;Lee Hyungdong;Lee Junho;Park Kunwoo
- 会议名称：《IEEE Conference on Electrical Performance of Electronic Packaging and Systems》 | 2011年
98.Full-wave PEEC time domain solver based on leapfrog scheme

机译：基于LEAPFROG方案的全波PEEC时域求解器
- 作者：Sekine Tadatoshi;Asai Hideki
- 会议名称：《IEEE Conference on Electrical Performance of Electronic Packaging and Systems》 | 2011年
99.3D via modeling simplification on multilayer mid-planes

机译：3D通过模拟MultiDayer中飞机的简化
- 作者：Li Qian;Melde Kathleen L.;Yeh Gong-Jong;Wu Hui;Yang Yaochao
- 会议名称：《IEEE Conference on Electrical Performance of Electronic Packaging and Systems》 | 2011年
- Cascade Method;
- Signal Integrity;
- Simplification;
- Via Modeling;
100.Three finite-element time-domain-based numerical algorithms for high-frequency broadband PCB simulations

机译：基于三个基于元数域的高频宽带PCB模拟数值算法
- 作者：Li Xiaolei;Jin Jian-Ming;Tan Jilin
- 会议名称：《IEEE Conference on Electrical Performance of Electronic Packaging and Systems》 | 2011年
- Integrated circuit;
- domain decomposition;
- finite element method;
- printed circuit board;
- time domain analysis;