MULTI-LEVEL SIGNALING FOR ON-PACKAGE CHIP-TO-CHIP INTERCONNECT THROUGH SILICON BRIDGE

摘要

One embodiment relates to an apparatus for data communication between at least two in-package semiconductor dies (106-1, 106-2). On the first semiconductor die (106-1) in a package, a digital-to-analog converter (DAC) converts a plurality of binary signals to an analog signal. The analog signal is transmitted through a silicon bridge (108) to a second semiconductor die (106-2). Another embodiment relates to a method of data communication between at least two in-package semiconductor dies (106-1, 106-2). A plurality of binary signals is converted to an analog signal by a digital-to-analog converter on a first semiconductor die (106-1). The analog signal is transmitted through a silicon bridge (108) to a second semiconductor die (106-2). Other embodiments, aspects and features are also disclosed.