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A new sub-threshold 7T SRAM cell design with capability of bit-interleaving in 90 nm CMOS

机译:新型亚阈值7T SRAM单元设计具有90 nm CMOS的位交错能力

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In this paper we present a new Static Random Access Memory (SRAM) that has 7 transistors in each cell. This idea allows for bit-interleaving that makes the SRAM more reliable against the soft errors. One of the challenges of a conventional 6 transistor (6T) SRAM cell in sub-threshold region is sizing of its access transistors. Here by separating access transistors of reading and writing, we mitigate this challenge. By using a minimum-size access transistor for reading, probability of unsuccessful read reduces. To have a more successful write operation, we make one of the inverters of the cell that is fighting with the write access transistor, weaker during write operation by floating its supply voltage and ground rails. After write operation, this inverter returns back to normal mode. Simulation results in 90 nm CMOS technology show that our design satisfies 4.5-sigma criterion for reading and writing at supply voltage of 300 mV. Compared to conventional 6T SRAM cell, our design improves read-time and write-time significantly. For example at supply voltage of 500 mV, these improvements are 137 and 83 percents, respectively. Comparing power and energy consumption for single write operation of the proposed 7T SRAM cell at supply voltage of 300mV with conventional 6T SRAM cell at 800mV (i.e. minimum achievable voltage for this SRAM cell) shows improvements of 133.4X and 266.78X, respectively.
机译:在本文中,我们提出了一种新的静态随机存取存储器(SRAM),每个单元中有7个晶体管。这种想法允许位交织,从而使SRAM能够更可靠地抵抗软错误。在亚阈值区域中的常规6晶体管(6T)SRAM单元面临的挑战之一是其访问晶体管的尺寸。在这里,通过分离读写的存取晶体管,我们减轻了这一挑战。通过使用最小尺寸的访问晶体管进行读取,读取失败的可能性降低了。为了使写操作更成功,我们使与写访问晶体管抗争的单元反相器之一在写操作期间通过浮动其电源电压和接地轨而变得较弱。写操作后,该逆变器返回正常模式。在90 nm CMOS技术中的仿真结果表明,我们的设计满足在300 mV的电源电压下进行读写的4.5-sigma标准。与传统的6T SRAM单元相比,我们的设计显着提高了读取时间和写入时间。例如,在500 mV的电源电压下,这些改进分别为137%和83%。将所建议的7T SRAM单元在电源电压为300mV时的单次写入操作的功率和能量消耗与传统的6T SRAM单元在800mV(即该SRAM单元可达到的最低电压)进行比较时,功率和能耗分别提高了133.4倍和266.78倍。

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