Wafer level packaging for GaAs optical detector using through wafer grooves (TWG) fabricated by mechanical dicing and wet etching

摘要

This paper reported a wafer level packaging (WLP) of GaAs optical detector, of which the packaging structure is featured by a Through Wafer Groove (TWG) fabricated by using a combined methodology of both mechanical dicing and wet chemical etching. This fabrication approach had the advantage of low process temperature (under 250 °C), low cost, no ion bombardment damage, and good uniformity. The packaging structure and the fabrication process were presented, and the results were discussed. Besides, the electrical connection was tested, which showed a high reliability.