METHOD FOR MANUFACTURING A CAMERA MODULE USING A WAFER LEVEL PACKAGE, CAPABLE OF SMOOTHLY PERFORMING A DICING OPERATION BY FORMING A DICING GROOVE ON A SPACER WAFER OR LENS SURFACE

摘要

PURPOSE: A method for manufacturing a camera module using a wafer level package is provided to increase durability and abrasion resistance of a dicing blade by reducing a region to be diced with a dicing blade.;CONSTITUTION: An image sensor is mounted on the upper side of a wafer and an external connection unit is included in the lower side of the wafer. An image sensor wafer(110) mounting a transparent unit is prepared for sealing the image sensor on the wafer. A lens wafer(130) is bonded on the image sensor wafer. A plurality of lenses and a spacer wafer with the dicing groove are successively stacked on the surface of a lens wafer. The spacer wafer is separated to a unit module by being diced along a dicing groove.;COPYRIGHT KIPO 2010