copper alloys; gold alloys; nickel alloys; shear strength; silver alloys; solders; tin alloys; β-Sn matrix; Aglt; subgt; 3lt; /subgt; Sn; Au-Ni; CeOlt; subgt; 2lt; /subgt; Cu-Sn-Ag-Cu; Cult; subgt; 3lt; /subgt; Sn; Cult; subgt; 6lt; /subgt; Snlt; subgt; 5lt; /subgt; aging time; composite solder joints; grain boundary; interfacial microstructure; island-shaped intermetallic compound layer; metallized substrates; scallop-shaped IMC layer; shear strength; solder paste; solid state aging; surface-active nanoparticles; uniformly distributed nanoparticles; Aging; Gold; Microstructure; Nickel; Reliability; Soldering; Substrates;
机译:铜(Cu)和镀金/镍(Au / Ni)的氧化铝(Al_2O_3)纳米颗粒掺杂锡银铜(Sn-Ag-Cu)焊料的微观结构,弹性模量和剪切强度
机译:ZrO_2纳米粒子的添加对Au / Ni金属化Cu垫上Sn-Ag-Cu焊料的微观结构和剪切强度的影响
机译:Al纳米粒子的添加对Au / Ni金属化Cu垫上共晶Sn-Ag-Cu焊料的显微结构和剪切强度的影响
机译:Cu和Au / Ni金属化Cu基体上Sn-Ag-Cu基复合焊料的界面微观结构和剪切强度
机译:微合金化对Sn-Ag-Cu无铅焊料组织演变的影响。
机译:固态时效期间Sn-3.0Ag-0.5Cu焊料与FeCoNiCrCu0.5衬底之间的界面处(FeCrCoNiCu)Sn2金属间化合物的生长受到抑制
机译:sn-ag和sn-ag-Cu无铅焊料的界面微观结构和接合强度回流Cu / Ni-p / au金属化