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Alternative Source/Drain Contact-Pad Architectures for Contact Resistance Improvement in Decanano-Scaled CMOS Devices

机译:替代源/漏极接触焊盘架构,用于癸烷的CMOS器件中的接触电阻改善

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摘要

A method for decreasing the parasitic source and drain contact resistances in decanano-scaled CMOS devices is presented in this work. The improvement of the electrical performance of the CMOS devices has been achieved by increasing the active contact area, without increasing the complete layout area consumption of the device, for lowering the parasitic source/drain contact resistances. Numerical simulations have been performed for investigating the influences of the new contact pad architectures on the electrical device behavior.
机译:在这项工作中,提出了一种减少脱甘淀粉CMOS器件中寄生源和漏极接触电阻的方法。通过增加有源接触面积,而不增加器件的完全布局面积消耗来实现CMOS器件的电气性能的改善,以降低寄生源/漏极接触电阻。已经进行了数值模拟,用于研究新的接触垫架构对电气设备行为的影响。

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