Simulation-Based Analysis of Thermo-Mechanical Constraints in Packages for Diamond Power Devices

机译：仿真基于钻石电源封装热机械约束的分析

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Diamond is one of the best wide band-gap semiconductor materials available for high power devices development in terms of high current capability, high temperature operability, breakdown voltage and switching speed. Unfortunately, fabrication technology f

机译：钻石是在高电流能力，高温可操作性，击穿电压和开关速度的高功率器件开发的最佳宽带间隙半导体材料之一。不幸的是，制造技术F

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《International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems》|2020年|395p|共8页
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作者
N. Fusté; O. Avi?ó; M. Vellvehi; X. Perpi?à; P. Godignon; R. Seddon; I. Obieta; J. Maudes; X. Jordà;
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正文语种
中图分类自动模拟理论（自动仿真理论）;
关键词
Strain; Diamond; Stress; Mathematical model; Finite element analysis; Multichip modules; Thermomechanical processes;

机译：菌株;钻石;压力;数学模型;有限元分析;多芯片模块;热机械过程;

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1. Power Blurring: Fast Static and Transient Thermal Analysis Method for Packaged Integrated Circuits and Power Devices [J] . Ziabari A., Park J., Ardestani E.K., Very Large Scale Integration (VLSI) Systems, IEEE Transactions on . 2014,第11期

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2. Fluid-solid coupling thermo-mechanical analysis of high power LED package during thermal shock testing [J] . Zhaohui Chen, Qin Zhang, Kai Wang, Microelectronics & Reliability . 2012,第8期

机译：大功率LED封装在热冲击测试期间的流固耦合热力学分析
3. Nanoscale Dynamic Mechanical Analysis on Heat-Resistant Silsesquioxane Nanocomposite for Power-Device Packaging [J] . Shijo Nagao, Naoki Fujisawa, Takuo Sugioka, Materials science forum . 2015,第期

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4. Simulation-Based Analysis of Thermo-Mechanical Constraints in Packages for Diamond Power Devices [C] . N. Fusté, O. Aviñó, M. Vellvehi, International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems . 2020

机译：基于仿真的金刚石功率器件封装中热机械约束分析
5. Multiscale Thermo-Mechanical Design and Analysis of High Frequency and High Power Vacuum Electron Devices. [D] . Gamzina, Diana. 2016

机译：高频和大功率真空电子器件的多尺度热机械设计和分析。
6. Synchrotron Bragg diffraction imaging characterization of synthetic diamond crystals for optical and electronic power device applications [O] . Thu Nhi Tran Thi, J. Morse, D. Caliste, -1

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7. Thermal and thermo-mechanical performance of voided lead-free solder thermal interface materials for chip-scale packaged power device [O] . Otiaba Kenny C. 2013

机译：用于芯片级封装功率器件的无孔无铅焊料热界面材料的热和热机械性能

Simulation-Based Analysis of Thermo-Mechanical Constraints in Packages for Diamond Power Devices

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