Nanoscale Dynamic Mechanical Analysis on Heat-Resistant Silsesquioxane Nanocomposite for Power-Device Packaging

摘要

Heat-resistance of novel mold compound made of silsesquioxane nanocomposite with silica fillers is demonstrated in a TO_247 package of SiC SBD. The test specimens are exposed to thermal cycling between -50 ℃ and 250 ℃, and the thermal damage of the mold are precisely evaluated by using nano-scale dynamical mechanical analysis based on nanoindentation technology. The results reveal that the excellent heat-resistance is brought by the miscibility between the thermosetting nanocomposite and silica fillers.