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Hybrid Integration of Bandgap Reference Circuits using Silicon ICs and Germanium Devices

机译:使用硅ICS和锗器件的带隙参考电路的混合集成

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Low-voltage hybrid silicon-germanium bandgap reference circuits that can defy the voltage scaling limits of those realized in purely silicon-based technologies are implemented. Germanium diodes replace silicon diodes in two conventional bandgap reference circuits fabricated in a 0.18-μm Si CMOS process, and experimental results validate the benefit of exploiting a low bandgap material. The output references are measured as 670 mV and 310 mV with 9.3 mV (287 ppm/°C) and 4.6 mV (302 ppm/°C)variation, respectively, over 5 ~ 56°C. In addition, the high temperature characteristics limiting the operation range related to low bandgap are investigated.
机译:低压混合硅 - 锗带隙参考电路,可以实现在纯粹的基于硅的技术中实现的那些电压缩放限制的参考电路。锗二极管在两个传统的带隙参考电路中更换硅二极管,在0.18-μmSiCMOS工艺中制造,实验结果验证了利用低带隙材料的益处。输出参考文献分别测量为670mV和310mV,分别为9.3mV(287ppm /°C)和4.6mV(302ppm /°C)变化,超过5〜56℃。此外,研究了限制与低带隙相关的操作范围的高温特性。

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