Design and Manufacture of a High Precision MEMS Flexible Force Sensor*

摘要

Flexible electronics is the research hotspot of micro devices nowadays. In this paper, a new type of flexible force sensor is proposed which adopts a cantilever beam structure, and four piezoresistors are arranged at the position of maximum stress. The size and distribution position of the resistors are determined by mechanical calculation and simulation. The flexible force sensor adopts MEMS etching technology to etch a cantilever beam on the monocrystalline silicon slice. By thinning the silicon substrate and filling the flexible material Parylene on the surface, the flexible three-dimensional structure of silicon-based micro-nano structure is realized through Parylene.